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MC14504BDTR2

Onsemi

MC14504BDTR2 by Onsemi

MC14504BDTR2 by Onsemi is a voltage level translator with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 3-18 V and max delay of 550 ns. Ideal for TTL/CMOS to CMOS translation in military-grade applications due to its compact size and high temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,135 parts In-Stock

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Digiode

USA . 358 parts In-Stock

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358

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AZTECH Wire

Italy . 153 parts In-Stock

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$20.380

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153

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TANS Electronics

Latvia . 7,785 parts In-Stock

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Problanco Electronics

Mexico . 6,436 parts In-Stock

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Kulean Microsystems

USA . 5,559 parts In-Stock

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Microchip USA

USA . 4,227 parts In-Stock

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SupplyDigital Components

Austria . 630 parts In-Stock

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UHIMA Technologies

Türkiye . 255 parts In-Stock

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Corohmni

South Africa . 247 parts In-Stock

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Corphita

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Overview

Unlock the potential of your electronic designs with the MC14504BDTR2 by Onsemi, a top-tier manufacturer known for delivering high-quality voltage level translators. Ideal for a wide range of applications, this versatile product offers customers unparalleled value and benefits. Say goodbye to compatibility issues and experience seamless voltage translation with the MC14504BDTR2. Trust Onsemi's expertise and innovation to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good insulation and protects the internal components of the voltage level translator, ensuring reliability and durability.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and reducing overall manufacturing costs.

Maximum Supply Voltage: 18 V

Ability to handle high supply voltages up to 18V makes this voltage level translator suitable for a wide range of applications requiring higher voltage levels.

No. of Functions: 6

Having 6 functions integrated into a single device allows for more complex voltage level translation tasks to be performed efficiently.

Package Shape: RECTANGULAR

Rectangular package shape is easy to handle and provides compatibility with standard PCB layouts, making integration into existing circuit designs straightforward.

Power Supplies (V): 5/15

Support for both 5V and 15V power supplies offers flexibility in various system configurations and compatibility with different voltage levels.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options for interfacing with other components and circuits, enabling versatile usage scenarios.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact small outline package with a thin profile and shrink pitch design saves space on the PCB, ideal for applications with limited board real estate.

Minimum Supply Voltage: 3 V

Support for low supply voltage down to 3V allows for operation in power-constrained environments while maintaining reliable performance.

Maximum Operating Temperature: 125 °C

Wide operating temperature range up to 125 °C ensures stable operation in harsh environmental conditions, making this voltage level translator suitable for industrial applications.

Minimum Operating Temperature: -55 °C

Ability to operate at low temperatures down to -55 °C ensures reliability in cold environments, making this component suitable for a variety of operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/palladium/gold terminal finish provides excellent corrosion resistance and ensures good electrical contact, enhancing the overall reliability and lifespan of the device.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and mounting orientation, allowing for easier integration into various circuit designs.

Maximum Seated Height: 1.2 mm

Low seated height of 1.2mm enables a slim profile, reducing the overall height of the assembly and making it suitable for applications with height constraints.

Width: 4.4 mm

Narrow width of 4.4mm saves space on the PCB, allowing for dense packing of components and efficient use of board real estate.

Output Polarity: TRUE

True output polarity ensures that the voltage level translator accurately translates input signals to the correct output levels, preventing signal distortion and errors in the communication.

Maximum Time At Peak Reflow Temperature (s): 40

With a maximum reflow time of 40 seconds at peak temperature, this voltage level translator is easy to solder onto the PCB, streamlining the manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260 °C ensures reliable soldering and robust mechanical connections, resulting in a durable and long-lasting assembly.

Length: 5 mm

Compact length of 5mm contributes to the overall small form factor of the device, enabling space-efficient PCB design and integration.

Temperature Grade: MILITARY

Military-grade temperature specifications indicate high reliability and performance in extreme conditions, making this voltage level translator suitable for demanding defense and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption, high speed operation, and compatibility with a wide range of voltage levels, making this voltage level translator energy-efficient and versatile.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability during soldering and assembly, ensuring secure connections and reliable performance over the long term.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V is a common standard in many electronic systems, making this voltage level translator widely compatible and easy to integrate into existing designs.

Maximum Delay: 550 ns

Low maximum delay of 550ns ensures fast signal translation and minimal propagation delay, making this voltage level translator suitable for high-speed applications where timing is critical.

Terminal Pitch: 0.65 mm

Small terminal pitch of 0.65mm allows for high-density mounting on the PCB, enabling efficient use of board space and compact layout designs.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Specifically designed for translating signals from TTL/CMOS interface to CMOS levels, this voltage level translator is ideal for bridging between different logic families and ensuring seamless communication between varying voltage domains.

Technical Specifications

Voltage Level Translators MC14504BDTR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

550 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

MC14504BDTR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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