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DP8481N

Texas Instruments

DP8481N by Texas Instruments

The Texas Instruments DP8481N is a voltage level translator with 16 terminals and operates on power supplies of 5V and -5.2V. It features TTL to ECL translation technology, with a max operating temperature of 70°C. This IC is commonly used in commercial-grade applications requiring precise signal conversion in electronic circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 5,184 parts In-Stock

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5,184

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 4,900 parts In-Stock

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4,900

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Vyrian

USA . 4,407 parts In-Stock

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4,407

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M&R Communications

USA . 1,310 parts In-Stock

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Anansix

USA . 1,066 parts In-Stock

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1,066

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Electronic Expediters

USA . 945 parts In-Stock

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945

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Zilex Electronics Inc.

Canada . 130 parts In-Stock

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130

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Resion

USA . 87 parts In-Stock

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87

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DF Sales Co.

USA . 56 parts In-Stock

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56

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DF Sales Co.

USA . 56 parts In-Stock

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56

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Sunrise Surplus Inc.

USA . 12 parts In-Stock

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12

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Elcom Components

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Native Components

USA . 721 parts In-Stock

1+ parts

$0.363

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$0.348

721

$0.363

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$0.348

Northwest PG Solutions

USA . 842 parts In-Stock

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$0.399

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$0.352

842

$0.399

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$0.352

Parana Technologies

USA . 881 parts In-Stock

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$9.739

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$10.318

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881

$9.739

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$10.318

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AZTECH Wire

Italy . 790 parts In-Stock

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$9.937

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790

$9.937

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DigiPath Technology Company

USA . 738 parts In-Stock

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$10.724

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$9.866

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738

$10.724

$9.866

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IDEA Electronic Components Group

UK . 1,409 parts In-Stock

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$10.943

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$10.396

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$9.849

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1,409

$10.943

$10.396

$9.849

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ChromeModa Solutions

Germany . 254 parts In-Stock

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$10.943

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$8.973

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254

$10.943

$8.973

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One Stop Electronics

USA . 1,072 parts In-Stock

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$31.500

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$31.500

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Corphita

USA . 3,326 parts In-Stock

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3,326

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Overview

Experience the superior quality and reliability of Texas Instruments with the DP8481N voltage level translator. This versatile device offers seamless signal translation for a wide range of applications, ensuring smooth communication between different voltage levels. With Texas Instruments' renowned reputation for excellence in semiconductor manufacturing, you can trust that the DP8481N delivers exceptional performance and durability. Say goodbye to compatibility issues and hello to streamlined operations with this innovative solution. Upgrade your systems today and unlock a world of possibilities with the DP8481N.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good durability and helps protect the internal components of the voltage level translator.

Power Supplies (V): 5,-5.2

Wide range of power supplies allows for versatile compatibility with different systems and devices.

No. of Terminals: 16

Sufficient number of terminals for connecting various input and output signals.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliable performance even in demanding environments.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making this voltage level translator suitable for fast data communication.

Technical Specifications

Voltage Level Translators DP8481N attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Sub-Category:

Level Translators

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

DP8481N Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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