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DP8480AN

Texas Instruments

DP8480AN by Texas Instruments

DP8480AN by Texas Instruments is a Voltage Level Translator with 5 functions, operating b/w -4.68V to 5.5V. It has a package style of IN-LINE and output polarity is inverted. Ideal for ECL to TTL translation applications due to its 15ns max delay and 3-STATE output characteristics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,225 parts In-Stock

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Anansix

USA . 2,039 parts In-Stock

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2,039

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Digiode

USA . 860 parts In-Stock

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860

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One Stop Electronics

USA . 1,160 parts In-Stock

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$0.500

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$0.500

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Native Components

USA . 782 parts In-Stock

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$1.528

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782

$1.528

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Northwest PG Solutions

USA . 487 parts In-Stock

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$1.681

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$1.681

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Parana Technologies

USA . 1,103 parts In-Stock

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$5.882

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$6.664

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$5.882

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$6.664

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DigiPath Technology Company

USA . 2,085 parts In-Stock

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$6.477

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$5.959

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$6.477

$5.959

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ChromeModa Solutions

Germany . 6,036 parts In-Stock

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$6.609

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$5.419

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$6.609

$5.419

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IDEA Electronic Components Group

UK . 1,948 parts In-Stock

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$6.609

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$5.948

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1,948

$6.609

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$5.948

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AZTECH Wire

Italy . 584 parts In-Stock

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$18.217

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Infinite Electronics LLP (Excess)

. 12,611 parts In-Stock

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Corphita

USA . 4,323 parts In-Stock

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Overview

Elevate your voltage level translation needs with the DP8480AN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers exceptional quality and reliability. This versatile voltage level translator is perfect for a variety of applications, offering customers unmatched value and benefits. Say goodbye to compatibility issues and hello to seamless communication with the DP8480AN. Trust Texas Instruments to provide innovative solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and resistant to various environmental factors, ensuring the longevity of the product.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, making it suitable for a wide range of applications.

No. of Functions: 5

Provides multiple conversion functions in a single device, offering versatility and convenience.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing electronic setups.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance when disabled, reducing interference in the system.

Technical Specifications

Voltage Level Translators DP8480AN attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

15 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

21.755 mm

No. of Bits:

1

No. of Functions:

5

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

-5.72 V

Minimum Supply Voltage-1:

-4.68 V

Nominal Supply Voltage-1:

-5.2 V

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

DP8480AN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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