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MC10H125MNG

Onsemi

MC10H125MNG by Onsemi

MC10H125MNG by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max supply voltage and -5.2V nominal negative supply voltage. It has a max delay of 3.1ns and is used as a TTL to ECL translator in commercial extended temperature grade applications.

Median Price

-

Lifecycle Status

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2

In-Stock Inventory

< 1k

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Vyrian

USA . 787 parts In-Stock

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Digiode

USA . 72 parts In-Stock

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Problanco Electronics

Mexico . 7,892 parts In-Stock

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SupplyDigital Components

Austria . 6,309 parts In-Stock

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TANS Electronics

Latvia . 5,784 parts In-Stock

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Kulean Microsystems

USA . 3,614 parts In-Stock

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Corphita

USA . 1,017 parts In-Stock

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UHIMA Technologies

Türkiye . 595 parts In-Stock

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Corohmni

South Africa . 154 parts In-Stock

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Overview

Enhance your electronic designs with the MC10H125MNG by Onsemi, a top-of-the-line Voltage Level Translator that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile component provides seamless voltage translation for a wide range of applications. With its advanced technology and innovative design, the MC10H125MNG ensures optimal performance and efficiency. Don't settle for anything less than the best - choose Onsemi for all your voltage level translation needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount design allows for easy installation on printed circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.25 V

Can handle a high maximum supply voltage, providing flexibility and versatility in various applications.

No. of Functions: 4

Having 4 functions in one device can simplify circuit design and reduce the number of components required.

Package Shape: SQUARE

Square package shape can make the device easier to handle and align during assembly.

No. of Bits: 2

2 bits offer enough resolution for many voltage translation applications while keeping the design simple.

Power Supplies (V): 5,-5.2

Supports dual power supplies of 5V and -5.2V, enabling compatibility with different voltage levels in the system.

No. of Terminals: 16

Having 16 terminals provides ample connection points, allowing for more versatility in circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Variety of package styles offer flexibility in mounting options and thermal management for different applications.

Minimum Supply Voltage: 4.75 V

Can operate with a low minimum supply voltage, ensuring compatibility with a wide range of power sources.

Maximum Operating Temperature: 75 °C

High maximum operating temperature tolerance allows for reliable operation in various environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility in interfacing with other components in the system.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the device can function in cold environments without issues.

Terminal Finish: MATTE TIN

Matte tin finish on terminals offers good solderability and corrosion resistance for long-term reliability.

Terminal Position: QUAD

Quad terminal position makes it easier to handle and mount the device on the PCB for efficient assembly.

Maximum Seated Height: 1 mm

Low maximum seated height saves space on the PCB and can be beneficial in slim profile applications.

Width: 3 mm

Compact width dimension allows for easy placement and routing of traces on the circuit board.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies the interface with other components and reduces the chances of errors in signal processing.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures the device can withstand the soldering process without damage.

Length: 3 mm

Short length dimension makes the device suitable for space-constrained applications while maintaining functionality.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade indicates reliability and performance consistency in various temperature environments.

Technology: ECL

ECL technology offers high-speed operation and low power consumption, making it suitable for applications requiring fast signal processing.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations and promotes environmental sustainability.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V provides compatibility with standard voltage levels in most electronic systems.

Nominal Negative Supply Voltage: -5.2 V

Nominal negative supply voltage of -5.2V allows for bi-directional voltage translation in the system.

Maximum Delay: 3.1 ns

Low maximum delay ensures fast signal propagation, which is crucial in high-speed communication applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch of 0.5mm enables compact design and efficient routing of traces on the PCB.

Interface IC Type: TTL TO ECL TRANSLATOR

Specific interface IC type indicates the device's capability to translate signals between TTL and ECL logic levels, enhancing compatibility in mixed-signal systems.

Technical Specifications

Voltage Level Translators MC10H125MNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.1 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N16

JESD-609 Code:

e3

Length:

3 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC16,.12SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

3 mm

Trade Compliance

MC10H125MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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