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SN10KHT5565DW

Texas Instruments

SN10KHT5565DW by Texas Instruments

SN10KHT5565DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. It operates b/w 0 to 75°C, has a max seated height of 2.65mm, and features TTL to ECL transceiver interface IC type. Ideal for applications requiring precise signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,321 parts In-Stock

1+ parts

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6,321

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Digiode

USA . 681 parts In-Stock

1+ parts

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-

1k+ parts

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681

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 346 parts In-Stock

1+ parts

$0.500

100+ parts

-

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346

$0.500

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AZTECH Wire

Italy . 541 parts In-Stock

1+ parts

$9.546

100+ parts

-

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541

$9.546

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Parana Technologies

USA . 2,315 parts In-Stock

1+ parts

$12.963

100+ parts

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1k+ parts

$13.455

10k+ parts

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2,315

$12.963

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$13.455

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ChromeModa Solutions

Germany . 2,231 parts In-Stock

1+ parts

$14.565

100+ parts

$11.943

1k+ parts

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2,231

$14.565

$11.943

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IDEA Electronic Components Group

UK . 142 parts In-Stock

1+ parts

$14.565

100+ parts

$13.837

1k+ parts

$13.108

10k+ parts

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142

$14.565

$13.837

$13.108

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DigiPath Technology Company

USA . 1,174 parts In-Stock

1+ parts

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100+ parts

$13.132

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1,174

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$13.132

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Corphita

USA . 342 parts In-Stock

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342

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Overview

Experience unparalleled quality and reliability with the SN10KHT5565DW voltage level translator by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers cutting-edge technology that meets the highest standards. Ideal for a wide range of applications, this product offers seamless voltage translation with 8 functions in a compact and durable package. Enhance your projects with the value, benefits, and advantages that the SN10KHT5565DW provides, ensuring optimal performance and efficiency every time. Elevate your designs with Texas Instruments' trusted solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body provides good protection for internal components and ensures durability of the device.

Surface Mount: YES

Surface mount capability allows for easier installation and integration into electronic circuit boards.

No. of Functions: 8

Having 8 functions in one device provides versatility and efficiency in voltage level translation applications.

Package Shape: RECTANGULAR

Rectangular package shape ensures easy stacking and placement on circuit boards.

No. of Terminals: 24

Having 24 terminals allows for multiple input and output connections, increasing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style helps in saving space on the circuit board and allows for denser packing of components.

Maximum Operating Temperature: 75 °C

High operating temperature range makes this voltage level translator suitable for a wide range of applications and environments.

Output Characteristics: 3-STATE

3-state output characteristics allow for high impedance state, which can be useful in bus-based communication systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in colder environments.

Terminal Position: DUAL

Dual terminal position offers flexibility in connection options and enables easy integration into different circuit layouts.

Maximum Seated Height: 2.65 mm

Low seated height helps in maintaining a compact form factor and allows for a sleek design.

Width: 7.5 mm

Narrow width makes this voltage level translator suitable for applications with space constraints.

Output Polarity: TRUE

True output polarity ensures accurate translation of voltage levels without any inversion.

Length: 15.4 mm

Compact length allows for easy placement and routing of traces on the circuit board.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade indicates that this device can operate reliably in a wide range of commercial applications.

Technology: ECL

ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making this device suitable for high-performance applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and mechanical stability during installation.

Maximum Delay: 0 ns

Zero delay ensures quick translation of voltage levels, ideal for time-sensitive applications.

Terminal Pitch: 1.27 mm

Smaller terminal pitch enables compact design and tight integration of components on the circuit board.

Interface IC Type: TTL TO ECL TRANSCEIVER

TTL to ECL transceiver interface IC type provides compatibility and seamless communication between different logic families in electronic systems.

Technical Specifications

Voltage Level Translators SN10KHT5565DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN10KHT5565DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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