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SN10KHT5575DW

Texas Instruments

SN10KHT5575DW by Texas Instruments

SN10KHT5575DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. It operates b/w 0-75°C, has a max seated height of 2.65mm, and features ECL to TTL translation for commercial extended temperature grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,388 parts In-Stock

1+ parts

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6,388

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Digiode

USA . 2,283 parts In-Stock

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2,283

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 658 parts In-Stock

1+ parts

$9.897

100+ parts

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658

$9.897

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Parana Technologies

USA . 1,041 parts In-Stock

1+ parts

$11.995

100+ parts

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1k+ parts

$12.401

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1,041

$11.995

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$12.401

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ChromeModa Solutions

Germany . 3,669 parts In-Stock

1+ parts

$13.477

100+ parts

$11.051

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3,669

$13.477

$11.051

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IDEA Electronic Components Group

UK . 858 parts In-Stock

1+ parts

$13.477

100+ parts

$12.803

1k+ parts

$12.129

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858

$13.477

$12.803

$12.129

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One Stop Electronics

USA . 219 parts In-Stock

1+ parts

$27.500

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219

$27.500

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Corphita

USA . 2,386 parts In-Stock

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2,386

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DigiPath Technology Company

USA . 2,145 parts In-Stock

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$12.151

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2,145

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$12.151

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Overview

Experience unparalleled performance and reliability with the SN10KHT5575DW by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments brings you a voltage level translator that boasts 8 functions and a compact design for seamless integration into your projects. Whether you're working on consumer electronics, industrial automation, or automotive applications, this versatile translator ensures optimal signal integrity and efficiency. Elevate your designs with the superior quality and value of the SN10KHT5575DW, setting new standards in voltage translation technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and ensuring reliable connections.

No. of Functions: 8

Provides multiple functions in a single component, saving cost and board space.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient packing and placement on circuit boards.

No. of Terminals: 24

Provides multiple connection points for versatile integration with other components.

Maximum Operating Temperature: 75 °C

Can operate reliably in high-temperature environments, making it suitable for a wide range of applications.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state, reducing power consumption and enabling bus sharing.

Minimum Operating Temperature: 0 °C

Can operate in low-temperature conditions without performance degradation.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit board layout and design.

Maximum Seated Height: 2.65 mm

Low-profile design saves space and allows for compact placement on the circuit board.

Width: 7.5 mm

Narrow width facilitates efficient use of board space and integration into compact systems.

Output Polarity: INVERTED

Inverted output polarity allows for flexibility in signal processing and compatibility with various systems.

Length: 15.4 mm

Compact length enables efficient packing and placement on the circuit board.

Temperature Grade: COMMERCIAL EXTENDED

Designed to operate reliably in extended commercial temperature ranges, suitable for a wide range of applications.

Technology: BIPOLAR

Bipolar technology offers high-speed and high-performance operation for voltage level translation.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections during installation on the circuit board.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of input signals.

Output Latch/Register: LATCH

Output latch/register feature provides stable output signals and ensures data integrity.

Nominal Supply Voltage: 5 V

Operates at a standard 5V supply voltage common in many electronic systems.

Nominal Negative Supply Voltage: -5.2 V

Provides a negative supply voltage option for specific applications requiring negative voltage levels.

Maximum Delay: 0 ns

Zero delay ensures quick response and minimal signal latency for time-critical applications.

Terminal Pitch: 1.27 mm

Compact terminal pitch allows for high-density integration on the circuit board and efficient connection design.

Interface IC Type: ECL TO TTL TRANSLATOR

Specific IC interface type for translating ECL to TTL signals accurately and reliably.

Technical Specifications

Voltage Level Translators SN10KHT5575DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN10KHT5575DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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