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SN65LVP20DRFTG4

Texas Instruments

SN65LVP20DRFTG4 by Texas Instruments

SN65LVP20DRFTG4 by Texas Instruments is a voltage level translator with 2.5/3.3V power supplies, PECL to LVPECL interface IC type, and 0.63ns max delay. It is used in industrial applications for translating signals b/w different voltage levels efficiently and accurately.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,989 parts In-Stock

1+ parts

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5,989

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Digiode

USA . 2,407 parts In-Stock

1+ parts

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2,407

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 347 parts In-Stock

1+ parts

$6.452

100+ parts

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347

$6.452

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Parana Technologies

USA . 419 parts In-Stock

1+ parts

$7.756

100+ parts

$720.295

1k+ parts

$6.981

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419

$7.756

$720.295

$6.981

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DigiPath Technology Company

USA . 1,866 parts In-Stock

1+ parts

$8.541

100+ parts

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1,866

$8.541

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ChromeModa Solutions

Germany . 5,804 parts In-Stock

1+ parts

$8.715

100+ parts

$7.146

1k+ parts

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5,804

$8.715

$7.146

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IDEA Electronic Components Group

UK . 1,908 parts In-Stock

1+ parts

$8.715

100+ parts

$8.279

1k+ parts

$7.844

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1,908

$8.715

$8.279

$7.844

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One Stop Electronics

USA . 1,185 parts In-Stock

1+ parts

$35.500

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1,185

$35.500

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Corphita

USA . 4,275 parts In-Stock

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4,275

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Overview

Enhance your electronic designs with the SN65LVP20DRFTG4 by Texas Instruments, a top-quality voltage level translator that offers seamless signal conversion for improved performance. Manufactured by industry leader Texas Instruments, this versatile device is perfect for a variety of applications, from consumer electronics to industrial automation. With its compact package and wide temperature range, the SN65LVP20DRFTG4 provides exceptional value and reliability. Upgrade your projects today with this innovative solution!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle high voltage levels without risk of damage.

Package Shape: SQUARE

Provides a compact design for efficient use of space on the PCB.

Power Supplies (V): 2.5/3.3

Compatible with common power supply voltages, allowing for versatile applications.

No. of Terminals: 8

Offers multiple connection points for seamless integration into the circuit.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Enhances heat dissipation and ensures a slim profile for space-constrained applications.

Minimum Supply Voltage: 2.375 V

Can operate efficiently even at low supply voltages.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments.

Minimum Operating Temperature: -40 °C

Can withstand cold temperatures without impacting performance.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Allows for versatile connection options in the circuit.

Maximum Seated Height: 0.8 mm

Low profile design for compact installations.

Width: 2 mm

Slim width for efficient use of space on the PCB.

Output Polarity: COMPLEMENTARY

Ensures accurate signal conversion between PECL and LVPECL interfaces.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a short duration during assembly.

Peak Reflow Temperature °C: 260

Suitable for high-temperature reflow soldering processes.

Length: 2 mm

Compact length for space-efficient circuit board layouts.

Temperature Grade: INDUSTRIAL

Designed to meet industrial temperature requirements for reliable operation in harsh environments.

Terminal Form: NO LEAD

Lead-free terminals for environmentally friendly manufacturing.

Nominal Supply Voltage: 2.5 V

Stable supply voltage for consistent performance.

Maximum Delay: 0.63 ns

Provides fast signal conversion with minimal delay.

Terminal Pitch: 0.5 mm

Close terminal spacing for efficient connections on the PCB.

Interface IC Type: PECL TO LVPECL TRANSLATOR

Specifically designed for translating signals between PECL and LVPECL interfaces.

Technical Specifications

Voltage Level Translators SN65LVP20DRFTG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

.63 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e4

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.8 mm

Sub-Category:

Line Driver or Receivers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

2 mm

Trade Compliance

SN65LVP20DRFTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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