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DP8482AM

Texas Instruments

DP8482AM by Texas Instruments

The Texas Instruments DP8482AM is a voltage level translator with 5 functions, operating b/w -4.815V to 5.5V. It features ECL technology, 3-STATE output characteristics, and a max delay of 15ns. Ideal for ECL to TTL translation applications due to its small outline package and inverted output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,519 parts In-Stock

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7,519

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Digiode

USA . 4,769 parts In-Stock

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4,769

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Anansix

USA . 1,068 parts In-Stock

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1,068

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Mentor Electronics Marketing, LLC

USA . 287 parts In-Stock

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287

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Q Components

USA . 210 parts In-Stock

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210

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Prism Electronics

USA . 28 parts In-Stock

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28

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 6 parts In-Stock

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6

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Distributors (Availability)

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Parana Technologies

USA . 725 parts In-Stock

1+ parts

$2.052

100+ parts

$190.591

1k+ parts

$1.847

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725

$2.052

$190.591

$1.847

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DigiPath Technology Company

USA . 169 parts In-Stock

1+ parts

$2.260

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169

$2.260

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IDEA Electronic Components Group

UK . 1,894 parts In-Stock

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$2.306

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$2.075

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1,894

$2.306

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$2.075

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ChromeModa Solutions

Germany . 190 parts In-Stock

1+ parts

$2.306

100+ parts

$1.891

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190

$2.306

$1.891

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AZTECH Wire

Italy . 861 parts In-Stock

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$5.427

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861

$5.427

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One Stop Electronics

USA . 1,170 parts In-Stock

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$48.500

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Corphita

USA . 3,531 parts In-Stock

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Northwest PG Solutions

USA . 1,731 parts In-Stock

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Native Components

USA . 846 parts In-Stock

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846

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Overview

Delivering seamless voltage translation for your electronic devices, the DP8482AM by Texas Instruments is a game-changer in the industry. With a reputation for producing high-quality components, Texas Instruments ensures reliability and performance in all their products. Ideal for a wide range of applications, this voltage level translator offers customers the value of smooth signal transitions and optimal power efficiency. Upgrade your devices with the DP8482AM and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and convenient installation on a PCB.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage levels, making it versatile for different applications.

No. of Functions: 5

Offers multiple functions in a single component, reducing the need for additional components on the circuit.

Package Shape: RECTANGULAR

Provides a standard shape for easy integration into existing designs.

Output Characteristics: 3-STATE

Allows the output to be in three different states, providing flexibility in the circuit design.

Technology: ECL

Utilizes Emitter-Coupled Logic technology for high-speed and low-power operation.

Nominal Supply Voltage: 5 V

Operates at a standard supply voltage, making it compatible with many systems.

Technical Specifications

Voltage Level Translators DP8482AM attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

15 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

10.3 mm

No. of Bits:

1

No. of Functions:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SO16(UNSPEC)

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

-4.815 V

Minimum Supply Voltage-1:

-4.185 V

Nominal Supply Voltage-1:

-4.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

DP8482AM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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