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DP8483F

Texas Instruments

DP8483F by Texas Instruments

The Texas Instruments DP8483F is a voltage level translator with 5 functions, operating b/w 4.5V to 5.5V. It features TTL to ECL translation, inverted output polarity, and a flat package style. Ideal for applications requiring precise signal conversion in temperature-sensitive environments up to 85°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,370 parts In-Stock

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Anansix

USA . 2,547 parts In-Stock

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Digiode

USA . 1,540 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 15 parts In-Stock

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AZTECH Wire

Italy . 597 parts In-Stock

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$5.953

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597

$5.953

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Parana Technologies

USA . 1,398 parts In-Stock

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$8.480

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$9.134

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$8.480

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DigiPath Technology Company

USA . 241 parts In-Stock

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$9.337

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241

$9.337

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ChromeModa Solutions

Germany . 3,847 parts In-Stock

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$9.528

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$7.813

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$9.528

$7.813

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

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$9.528

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$9.052

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$8.575

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Native Components

USA . 738 parts In-Stock

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$34.477

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$33.098

738

$34.477

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$33.098

Northwest PG Solutions

USA . 144 parts In-Stock

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$37.925

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One Stop Electronics

USA . 510 parts In-Stock

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$40.500

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Corphita

USA . 1,786 parts In-Stock

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Overview

Elevate your voltage level translation needs with the DP8483F by Texas Instruments. Crafted with precision and reliability, this voltage level translator offers seamless integration in various applications. From TTL to ECL translation, this versatile component ensures optimal performance and efficiency. Trust in Texas Instruments' renowned quality and expertise to deliver a product that exceeds expectations. Experience the value and benefits of the DP8483F, designed to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability for this voltage level translator, making it suitable for various environments.

Surface Mount: YES

Being surface mountable, this product is easy to install and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5V, this voltage level translator can handle higher voltage inputs without getting damaged.

No. of Functions: 5

The presence of 5 functions in this voltage level translator allows for versatile signal conversion capabilities.

Package Shape: RECTANGULAR

The rectangular package shape makes it easy to integrate this voltage level translator into circuit designs efficiently.

No. of Terminals: 16

With 16 terminals, this voltage level translator offers multiple connection points for flexible use in different circuit configurations.

Package Style (Meter): FLATPACK

The flatpack package style adds to the compactness and ease of assembly of this voltage level translator.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures reliable operation even under lower voltage conditions.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, this voltage level translator can withstand elevated temperature environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C indicates that this voltage level translator can function effectively in colder conditions as well.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides a reliable connection interface for this voltage level translator.

Terminal Position: DUAL

The dual terminal position offers flexibility in installation and connection options for this voltage level translator.

Maximum Seated Height: 2.159 mm

With a maximum seated height of 2.159mm, this voltage level translator can be used in applications with height constraints.

Width: 6.731 mm

The compact width of 6.731mm makes this voltage level translator suitable for space-constrained designs.

Output Polarity: INVERTED

The inverted output polarity of this voltage level translator enables signal inversion as required in certain applications.

Technology: ECL

Utilizing ECL technology ensures high-speed and low-power operation in this voltage level translator.

Terminal Form: FLAT

The flat terminal form simplifies the connection process and ensures stability in signal transmission for this voltage level translator.

Output Latch/Register: LATCH

The latch output feature allows for temporary storage of output signals, adding flexibility to the signal processing capabilities of this voltage level translator.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage ensures compatibility with standard voltage levels in most electronic systems.

Nominal Negative Supply Voltage: -4.5 V

The -4.5V nominal negative supply voltage enables bidirectional signal translation in this voltage level translator.

Maximum Delay: 0 ns

With zero nanoseconds of delay, this voltage level translator ensures minimal signal processing latency for efficient operation.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for easy alignment and connection of this voltage level translator in circuit layouts.

Interface IC Type: TTL TO ECL TRANSLATOR

The specific interface IC type of TTL to ECL translator indicates the compatibility and seamless signal conversion between TTL and ECL logic levels.

Technical Specifications

Voltage Level Translators DP8483F attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-GDFP-F16

JESD-609 Code:

e0

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

5

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DFP

Package Equivalence Code:

FL16,.3

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

6.731 mm

Trade Compliance

DP8483F Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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