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SN100KT5575NT

Texas Instruments

SN100KT5575NT by Texas Instruments

SN100KT5575NT by Texas Instruments is an 8-function voltage level translator with a package style of IN-LINE. It operates b/w 0-85°C, has 3-STATE output characteristics, and uses BIPOLAR technology. Ideal for ECL to TTL translation applications due to its inverted output polarity and latch/register feature.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,231 parts In-Stock

1+ parts

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8,231

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Digiode

USA . 4,484 parts In-Stock

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4,484

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 866 parts In-Stock

1+ parts

$2.147

100+ parts

-

1k+ parts

$2.659

10k+ parts

-

866

$2.147

-

$2.659

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DigiPath Technology Company

USA . 692 parts In-Stock

1+ parts

$2.364

100+ parts

$2.175

1k+ parts

-

10k+ parts

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692

$2.364

$2.175

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ChromeModa Solutions

Germany . 2,761 parts In-Stock

1+ parts

$2.412

100+ parts

$1.978

1k+ parts

-

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2,761

$2.412

$1.978

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IDEA Electronic Components Group

UK . 1,899 parts In-Stock

1+ parts

$2.412

100+ parts

-

1k+ parts

$2.171

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1,899

$2.412

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$2.171

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AZTECH Wire

Italy . 470 parts In-Stock

1+ parts

$13.657

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470

$13.657

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One Stop Electronics

USA . 888 parts In-Stock

1+ parts

$29.500

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888

$29.500

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Corphita

USA . 3,193 parts In-Stock

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3,193

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Overview

Unlock the potential of your electronic devices with the high-quality SN100KT5575NT voltage level translator by Texas Instruments. With its innovative design and reliable performance, this product is perfect for a wide range of applications. From consumer electronics to industrial machinery, this voltage level translator offers seamless integration and optimal efficiency. Trust in Texas Instruments' reputation for excellence and enhance your projects with the SN100KT5575NT today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body makes the product lightweight and durable, suitable for various applications.

No. of Functions: 8

Having 8 functions in one unit increases the versatility and efficiency of the product, allowing for multiple functions to be carried out simultaneously.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this product can operate effectively even in demanding industrial environments.

Output Characteristics: 3-STATE

The 3-STATE output allows the device to have three output states, adding flexibility and control to the system in which it is used.

Technology: BIPOLAR

Bipolar technology ensures fast and accurate signal translation, making this product ideal for applications requiring high-speed data transmission.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage makes this product compatible with a wide range of electronic devices and systems, increasing its usability.

Technical Specifications

Voltage Level Translators SN100KT5575NT attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN100KT5575NT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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