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MC100EPT23MNR4

Onsemi

MC100EPT23MNR4 by Onsemi

MC100EPT23MNR4 by Onsemi is a PECL to TTL translator with 2 functions, operating at 3.3V. It offers fast performance with a max delay of 1.8ns and operates in industrial temperature range (-40 to 85 °C). Ideal for voltage level translation applications requiring high-speed signal conversion.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,751 parts In-Stock

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Digiode

USA . 1,601 parts In-Stock

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1,601

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Distributors (Availability)

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AZTECH Wire

Italy . 949 parts In-Stock

1+ parts

$15.810

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949

$15.810

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SupplyDigital Components

Austria . 7,368 parts In-Stock

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Kulean Microsystems

USA . 6,364 parts In-Stock

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TANS Electronics

Latvia . 6,134 parts In-Stock

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6,134

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Problanco Electronics

Mexico . 5,112 parts In-Stock

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Microchip USA

USA . 227 parts In-Stock

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Corphita

USA . 221 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

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UHIMA Technologies

Türkiye . 68 parts In-Stock

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Overview

Enhance your electronic designs with the MC100EPT23MNR4 by Onsemi, a top-tier manufacturer known for its quality and reliability. This voltage level translator offers seamless integration and superior performance in a variety of applications. Elevate your projects with this cutting-edge technology that provides value, efficiency, and precision, giving you a competitive edge in the market. Trust Onsemi to deliver innovative solutions that meet your needs and exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the voltage level translator, ensuring long-lasting performance.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input voltages, making it versatile for various applications.

No. of Functions: 2

Having two functions allows this voltage level translator to perform multiple tasks simultaneously, enhancing efficiency in a circuit design.

Package Shape: SQUARE

The square package shape offers a compact form factor, saving space on the circuit board and making it suitable for applications with limited area.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with standard voltage levels, making integration into existing systems seamless.

No. of Terminals: 8

With eight terminals, this voltage level translator provides flexibility for connecting to other components in the circuit, enabling versatile circuit designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style offer efficient heat dissipation and space-saving benefits, making it ideal for compact designs.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3V ensures reliable operation even at lower power levels, enabling energy-efficient performance.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this voltage level translator can withstand harsh environmental conditions, ensuring reliable operation in various applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C allows this voltage level translator to function in extreme cold conditions, making it suitable for outdoor or industrial applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring secure connections and reliable performance in the circuit.

Terminal Position: DUAL

The dual terminal position allows for flexible installation and connection options, accommodating different circuit layouts and configurations.

Maximum Seated Height: 1 mm

The low maximum seated height saves space on the circuit board and allows for a compact design, ideal for applications with height restrictions.

Width: 2 mm

The 2mm width offers a slim profile, making this voltage level translator suitable for applications where space is limited and a compact form factor is crucial.

Output Polarity: TRUE

The true output polarity ensures correct signal transmission and interpretation, preventing errors in data communication and improving overall system reliability.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature of 235 °C, this voltage level translator can withstand the soldering process during assembly, ensuring durability and reliability.

Length: 2 mm

The 2mm length contributes to the compact size of this voltage level translator, making it suitable for space-constrained applications and enabling efficient circuit board layout.

Temperature Grade: INDUSTRIAL

The industrial temperature grade certification indicates that this voltage level translator meets the required standards for reliability and performance in industrial environments.

Technology: ECL

The ECL (Emitter-Coupled Logic) technology offers high-speed operation and low power consumption, making this voltage level translator ideal for applications that require fast data processing and energy efficiency.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the installation and connection process, reducing the risk of solder bridging and ensuring a secure connection for reliable performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems straightforward and hassle-free.

Maximum Delay: 1.8 ns

With a maximum delay of 1.8ns, this voltage level translator offers fast signal transmission and minimal latency, enhancing overall system performance and responsiveness.

Terminal Pitch: 0.5 mm

The 0.5mm terminal pitch allows for precise and accurate connection to other components on the circuit board, ensuring reliable signal transmission and connectivity in the system.

Interface IC Type: PECL TO TTL TRANSLATOR

The PECL to TTL translator interface IC type enables seamless communication between different logic levels, making this voltage level translator versatile for a wide range of applications requiring signal conversion.

Technical Specifications

Voltage Level Translators MC100EPT23MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

1.8 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100EPT23MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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