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MC100EP91MNR2

Onsemi

MC100EP91MNR2 by Onsemi

MC100EP91MNR2 by Onsemi is a voltage level translator with 3 functions, operating at -40 to 85 °C. It has a supply voltage range of 2.375-3.8 V and max delay of 0.75 ns. Ideal for ECL to PECL translation in industrial applications due to its compact square package and low profile design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,910 parts In-Stock

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Digiode

USA . 439 parts In-Stock

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439

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Problanco Electronics

Mexico . 7,520 parts In-Stock

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7,520

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Kulean Microsystems

USA . 5,572 parts In-Stock

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TANS Electronics

Latvia . 3,367 parts In-Stock

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Corphita

USA . 1,794 parts In-Stock

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SupplyDigital Components

Austria . 1,015 parts In-Stock

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Corohmni

South Africa . 483 parts In-Stock

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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Overview

Unlock seamless voltage level translation with the MC100EP91MNR2 by Onsemi. Designed with precision and quality in mind, this voltage level translator offers customers a reliable solution for their electronic applications. With a wide operating temperature range and compact package style, this product provides flexibility and efficiency. Trust in Onsemi's expertise and enhance your design with the MC100EP91MNR2 today.

Feature Benefit Bullets

Surface Mount - YES

This feature allows for easy and efficient integration into surface mount PCB designs, saving space and simplifying the assembly process.

Maximum Supply Voltage - 3.8 V

With a high maximum supply voltage, this product is suitable for applications requiring robust voltage levels.

No. of Functions - 3

Having multiple functions in one device reduces the need for additional components, saving cost and board space.

Maximum Operating Temperature - 85 °C

The high maximum operating temperature makes this product suitable for industrial environments where temperature fluctuations may occur.

Minimum Operating Temperature -40 °C

The wide operating temperature range enables this product to function reliably even in extreme cold climates.

Nominal Supply Voltage - 3.3 V

The nominal supply voltage of 3.3 V ensures compatibility with standard power sources, making integration easier.

Maximum Delay - 0.75 ns

The low maximum delay ensures fast signal translation, making this product ideal for high-speed applications.

Technical Specifications

Voltage Level Translators MC100EP91MNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.75 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e0

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3,-3.3/-5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

MC100EP91MNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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