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100328FC

Texas Instruments

100328FC by Texas Instruments

The Texas Instruments 100328FC is a voltage level translator with 8 functions, operating b/w -5V to 5.5V. It features a flatpack package style, quad terminal position, and true output polarity. Ideal for TTL to ECL transceiver applications with standard input characteristics and a max delay of 6.5ns at temperatures ranging from 0°C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 9,569 parts In-Stock

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9,569

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Atlantic Semiconductor

USA . 9,569 parts In-Stock

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9,569

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Vyrian

USA . 4,355 parts In-Stock

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4,355

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Digiode

USA . 2,663 parts In-Stock

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2,663

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Anansix

USA . 725 parts In-Stock

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725

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Elcom Components

USA . 359 parts In-Stock

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359

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Electronic Expediters

USA . 13 parts In-Stock

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13

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Distributors (Availability)

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Parana Technologies

USA . 2,352 parts In-Stock

1+ parts

$1.825

100+ parts

-

1k+ parts

$2.377

10k+ parts

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2,352

$1.825

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$2.377

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DigiPath Technology Company

USA . 20 parts In-Stock

1+ parts

$2.010

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20

$2.010

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ChromeModa Solutions

Germany . 2,588 parts In-Stock

1+ parts

$2.051

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$1.682

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2,588

$2.051

$1.682

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IDEA Electronic Components Group

UK . 1,827 parts In-Stock

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$2.051

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$1.846

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1,827

$2.051

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$1.846

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Northwest PG Solutions

USA . 1,292 parts In-Stock

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$3.572

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$3.572

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One Stop Electronics

USA . 1,404 parts In-Stock

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$6.500

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$6.500

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AZTECH Wire

Italy . 513 parts In-Stock

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$7.979

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513

$7.979

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Corphita

USA . 5,185 parts In-Stock

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Supply Digital

USA . 1,608 parts In-Stock

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1,608

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ChipstoGo Electronic ltd

UK . 347 parts In-Stock

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347

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Native Components

USA . 36 parts In-Stock

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$3.150

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36

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$3.150

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Overview

Elevate your voltage level translation with the 100328FC by Texas Instruments. Crafted with top-quality materials and advanced technology, this voltage level translator offers seamless integration and superior performance in a wide range of applications. Experience the value of reliable signal conversion, enhanced system efficiency, and simplified design processes with this innovative solution. Trust Texas Instruments to deliver excellence in every component, empowering you to elevate your projects to new heights with ease.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed package body material ensures durability and reliability in various operating conditions.

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, providing a wide operating range for compatibility with different systems.

No. of Functions: 8

Provides multiple functions in a single device, offering efficiency and compactness in circuit design.

Power Supplies (V): 5,-4.5

Supports dual power supplies, enabling adaptable power configurations for diverse application requirements.

Package Shape: SQUARE

The square package shape offers a uniform footprint for consistent placement and alignment in circuit layouts.

Minimum Supply Voltage: 4.5 V

With a low minimum supply voltage, the device can operate effectively even in low-power scenarios.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably at high temperatures, enhancing the product's versatility in various environments.

Output Characteristics: 3-STATE

The 3-STATE output allows for high impedance when disabled, reducing signal interference and improving overall system performance.

Minimum Operating Temperature: 0 °C

Operates efficiently at low temperatures, ensuring consistent performance in diverse temperature conditions.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish offers strong solderability and electrical conductivity, ensuring secure connections.

Maximum Supply Current: 74 mA

With a moderate supply current, the device consumes power efficiently while maintaining stable operation.

Technical Specifications

Voltage Level Translators 100328FC attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

6.5 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-GQFP-F24

JESD-609 Code:

e0

Length:

9.398 mm

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

QFF

Package Equivalence Code:

QFL24,.4SQ

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

2.159 mm

Sub-Category:

Level Translators

Maximum Supply Current:

74 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

9.398 mm

Trade Compliance

100328FC Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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