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MC100EPT26DTR2G

Onsemi

MC100EPT26DTR2G by Onsemi

MC100EPT26DTR2G by Onsemi is a voltage level translator with 3.3V power supply, operating from -40 to 85 °C. It features PECL to TTL translation, totem-pole output, and 2.2ns max delay. Ideal for industrial applications requiring precise signal conversion in compact spaces.

Median Price

$8.270

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 768 parts In-Stock

1+ parts

$9.790

100+ parts

$6.590

1k+ parts

-

10k+ parts

$5.758

768

$9.790

$6.590

-

$5.758

Mouser Electronics

USA . 24 parts In-Stock

1+ parts

$9.790

100+ parts

$6.600

1k+ parts

$5.860

10k+ parts

$5.600

24

$9.790

$6.600

$5.860

$5.600

Rochester

USA . 6,129 parts In-Stock

1+ parts

-

100+ parts

$5.400

1k+ parts

$4.830

10k+ parts

$4.540

6,129

-

$5.400

$4.830

$4.540

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$6.750

1k+ parts

$6.037

10k+ parts

$5.675

2,500

-

$6.750

$6.037

$5.675

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,239 parts In-Stock

1+ parts

$10.716

100+ parts

-

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1,239

$10.716

-

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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Vyrian

USA . 3,641 parts In-Stock

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3,641

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Velocity Electronics

USA . 2,500 parts In-Stock

1+ parts

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2,500

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Semi Source

USA . 1,882 parts In-Stock

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1,882

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Bristol Electronics

USA . 1,766 parts In-Stock

1+ parts

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1,766

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Sea View Technologies

USA . 662 parts In-Stock

1+ parts

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662

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Speed Components Ltd

Israel . 90 parts In-Stock

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90

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NexGen Digital

USA . 36 parts In-Stock

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36

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Microfarads

USA . 28 parts In-Stock

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28

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,392 parts In-Stock

1+ parts

$10.152

100+ parts

-

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1,392

$10.152

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Corohmni

South Africa . 88 parts In-Stock

1+ parts

$11.280

100+ parts

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88

$11.280

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QUARKTWIN TECHNOLOGY LTD

USA . 29,388 parts In-Stock

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29,388

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SupplyDigital Components

Austria . 7,587 parts In-Stock

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7,587

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Kepictronics

USA . 6,200 parts In-Stock

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6,200

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Kulean Microsystems

USA . 6,151 parts In-Stock

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6,151

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Microchip USA

USA . 3,959 parts In-Stock

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3,959

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Problanco Electronics

Mexico . 3,361 parts In-Stock

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3,361

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TANS Electronics

Latvia . 1,950 parts In-Stock

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Metaverse IC Inc.

Canada . 1,350 parts In-Stock

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UHIMA Technologies

Türkiye . 527 parts In-Stock

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527

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Speed Components Ltd (Excess)

Israel . 74 parts In-Stock

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Perfect Parts

USA . 25 parts In-Stock

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25

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Overview

Enhance your electronic designs with the MC100EPT26DTR2G by Onsemi, a top-tier manufacturer known for delivering high-quality voltage level translators. Perfect for industrial applications, this PECL to TTL translator offers seamless signal conversion and reliable performance. With a compact design and a wide operating temperature range, this small outline package is a game-changer for your projects. Experience faster communication and improved efficiency with the MC100EPT26DTR2G - the ultimate solution for your voltage translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Makes it easy to install and solder onto circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 3.6 V

Allows for compatibility with a wide range of input voltages, making it versatile for different applications.

Package Shape: SQUARE

The square shape is space-efficient and can easily fit into compact electronic devices.

Power Supplies (V): 3.3

Operates efficiently on a common power supply voltage, ensuring stability and reliability.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components, allowing for flexible circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile save space on the circuit board, while the shrink pitch makes it easier to solder.

Minimum Supply Voltage: 3 V

Can operate on a lower supply voltage, offering energy efficiency in applications where power consumption is a concern.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, making it suitable for industrial environments or applications where heat may be a factor.

Output Characteristics: TOTEM-POLE

The totem-pole output allows for both high and low output signals, providing flexibility in interfacing with different types of devices.

Minimum Operating Temperature: -40 °C

Can operate in extremely cold temperatures, ensuring functionality in a wide range of environmental conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal positions offer more flexibility in PCB layout and installation, accommodating different design requirements.

Maximum Seated Height: 1.1 mm

The low seated height allows for a compact design, ideal for thin electronic devices or space-constrained applications.

Width: 3 mm

The narrow width saves space on the PCB, enabling more components to be placed in a limited area.

Output Polarity: TRUE

True output polarity ensures compatibility with devices that require a specific signal polarity for proper operation.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient amount of time during the manufacturing process, ensuring proper soldering.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures, making it suitable for lead-free soldering processes.

Length: 3 mm

The short length helps in saving PCB space and accommodating compact designs.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability in demanding applications.

Technology: ECL

Uses ECL technology for high-speed operation and low power consumption, suitable for applications requiring fast signal processing.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and inspection during manufacturing, leading to a more efficient production process.

Nominal Supply Voltage: 3.3 V

Operates at a commonly used supply voltage, making it compatible with a wide range of electronic devices.

Maximum Delay: 2.2 ns

Provides fast signal translation with minimal delay, ensuring efficient communication between different voltage domains.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting on the PCB, saving space and enabling more compact designs.

Moisture Sensitivity Level (MSL): 3

With MSL 3 classification, the product can withstand moderate exposure to moisture during storage and handling.

Interface IC Type: PECL TO TTL TRANSLATOR

Specifically designed to translate signal levels between PECL and TTL logic, providing seamless communication between devices operating at different voltage levels.

Technical Specifications

Voltage Level Translators MC100EPT26DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100EPT26DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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