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MC10125FN

Onsemi

MC10125FN by Onsemi

MC10125FN by Onsemi is a voltage level translator with 4 functions, operating at -30 to 85 °C. It has ECL10K technology, translating ECL to TTL signals with a delay of 6ns. Ideal for applications requiring true output polarity and power supplies of 5V and -5.2V.

Median Price

$7.170

Lifecycle Status

Suppliers In-Stock

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In-Stock Inventory

1k+

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DF Sales Co.

USA . 390 parts In-Stock

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$2.800

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DF Sales Co.

USA . 390 parts In-Stock

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Component Electronics Inc.

Canada . 102 parts In-Stock

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American Microsemiconductor Inc.

USA . 521 parts In-Stock

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Digiode

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Vyrian

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CirComp Electronics, Inc.

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A2Z Electronics, Inc.

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EMSNET

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Cyclops Electronics Ltd

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LWI Electronics Inc

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Electronic Expediters

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R&J Components

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Beltway Electronics Company

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Speed Components Ltd

Israel . 24 parts In-Stock

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Sogenti Electronics

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Mil-Aero Solutions, Inc.

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Semi Source

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Electronics Depot

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Connector Distribution Corp

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First Choice Components Inc.

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Right Parts Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Pegasus Components GmbH

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Resion

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Corohmni

South Africa . 320 parts In-Stock

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Perfect Parts

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Kepictronics

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Kulean Microsystems

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Problanco Electronics

Mexico . 3,764 parts In-Stock

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SupplyDigital Components

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Corphita

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TANS Electronics

Latvia . 610 parts In-Stock

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UHIMA Technologies

Türkiye . 339 parts In-Stock

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GreenTree Electronics

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Overview

Unlock seamless voltage level translation with the MC10125FN by Onsemi. This innovative chip carrier offers reliable performance and versatility in a compact square package. Perfect for a wide range of applications, this voltage translator effortlessly converts signals from ECL to TTL with minimal delay. Trust the quality and expertise of Onsemi to deliver a superior product that exceeds expectations. Enhance your projects with the MC10125FN and experience the benefits of smooth signal transmission and efficient operation. Elevate your designs with Onsemi's cutting-edge technology today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the components inside, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable makes the product easy to integrate onto circuit boards, saving space and simplifying assembly.

No. of Functions: 4

Having multiple functions in one device saves cost and board space, making the product efficient for complex systems.

Package Shape: SQUARE

The square shape is convenient for placement and alignment on the circuit board, aiding in efficient design layout.

Power Supplies (V): 5,-5.2

Compatibility with different power supply voltages allows flexibility in system design and integration.

No. of Terminals: 20

Having 20 terminals enables connectivity with various components, enhancing the product's versatility in different applications.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures reliability in various environments, making the product suitable for industrial use.

Output Characteristics: TOTEM-POLE

The totem-pole output type provides strong and fast signal transitions, improving signal integrity and reducing transmission errors.

Minimum Operating Temperature: -30 °C

The low minimum operating temperature extends the product's usability in cold environments, increasing its reliability in diverse conditions.

Terminal Finish: TIN LEAD

The tin lead finish offers good solderability and conductivity, facilitating easy and reliable connections during assembly.

Maximum Seated Height: 4.57 mm

The low seated height allows for a compact design, saving space in the overall system layout.

Width: 8.965 mm

The precise width measurement ensures compatibility with standard board layouts, simplifying integration into existing systems.

Output Polarity: TRUE

Having a true output polarity ensures accurate signal transmission and reception in the system, reducing errors and improving overall performance.

Peak Reflow Temperature °C: 235

The high peak reflow temperature allows for reliable soldering during assembly processes, ensuring durable connections for the product.

Technology: ECL10K

The ECL10K technology offers high-speed performance and low power consumption, making the product ideal for high-speed data transmission applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage compatibility simplifies integration with standard power sources, ensuring reliable performance in typical operating conditions.

Nominal Negative Supply Voltage: -5.2 V

The compatibility with negative supply voltages enables the product to work with a wider range of power sources, increasing its versatility.

Maximum Delay: 6 ns

The low maximum delay time ensures quick signal propagation, reducing latency in the system and improving overall efficiency.

Terminal Pitch: 1.27 mm

The precise terminal pitch allows for easy connections and alignment with standard board designs, enhancing compatibility and simplifying assembly.

Interface IC Type: ECL TO TTL TRANSLATOR

Being an ECL to TTL translator enables seamless communication between different signal types, ensuring compatibility and efficient data transmission in mixed-signal systems.

Technical Specifications

Voltage Level Translators MC10125FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

6 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

Output Characteristics:

TOTEM-POLE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL10K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10125FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-543-5990, 5962015435990

NIIN

015435990

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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