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MC100RPT26DTR2G

Onsemi

MC100RPT26DTR2G by Onsemi

MC100RPT26DTR2G by Onsemi is a voltage level translator with 8 terminals, operating b/w -40 to 85 °C. It has a max supply voltage of 3.6 V and min of 3 V, suitable for industrial applications requiring PECL to TTL translation with a delay of 2.2 ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,080 parts In-Stock

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Vyrian

USA . 134 parts In-Stock

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Problanco Electronics

Mexico . 7,617 parts In-Stock

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Kulean Microsystems

USA . 4,473 parts In-Stock

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TANS Electronics

Latvia . 3,361 parts In-Stock

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SupplyDigital Components

Austria . 2,899 parts In-Stock

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Corphita

USA . 2,030 parts In-Stock

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UHIMA Technologies

Türkiye . 762 parts In-Stock

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Corohmni

South Africa . 405 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC100RPT26DTR2G by Onsemi. This high-quality product from a trusted manufacturer offers reliable performance and versatility for a wide range of applications. With its compact design and advanced technology, this voltage level translator provides seamless integration and efficient operation. Experience the value and benefits of this product firsthand, and take your projects to the next level with the MC100RPT26DTR2G. Elevate your voltage level translation needs with Onsemi's MC100RPT26DTR2G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

The surface mount option allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this voltage level translator can accommodate a wide range of input voltage levels, making it versatile and adaptable to different systems.

Minimum Supply Voltage: 3 V

The minimum supply voltage of 3 V ensures compatibility with lower voltage systems, providing flexibility in design and application.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C allows for reliable performance in a variety of environmental conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables the voltage level translator to function effectively in cold climates or extreme temperature environments.

Maximum Delay: 2.2 ns

The low maximum delay of 2.2 ns ensures fast signal transmission and minimal latency, making this voltage level translator ideal for high-speed applications.

Technical Specifications

Voltage Level Translators MC100RPT26DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Input Characteristics:

DIFFERENTIAL

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.1 mm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

MC100RPT26DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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