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MC10H351MELG

Onsemi

MC10H351MELG by Onsemi

MC10H351MELG by Onsemi is a voltage level translator with 4 functions, operating at 5V. It has a max supply voltage of 5.25V and min of 4.75V, suitable for commercial extended temperature grade applications. The IC features TTL/NMOS to ECL translation with a delay of 2.2ns, making it ideal for high-speed signal processing in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,410 parts In-Stock

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Digiode

USA . 793 parts In-Stock

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793

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AZTECH Wire

Italy . 907 parts In-Stock

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$20.680

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907

$20.680

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Microchip USA

USA . 5,970 parts In-Stock

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Problanco Electronics

Mexico . 5,470 parts In-Stock

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TANS Electronics

Latvia . 2,349 parts In-Stock

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SupplyDigital Components

Austria . 2,065 parts In-Stock

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Kulean Microsystems

USA . 1,662 parts In-Stock

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Corphita

USA . 629 parts In-Stock

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UHIMA Technologies

Türkiye . 580 parts In-Stock

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Corohmni

South Africa . 168 parts In-Stock

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Overview

Discover the cutting-edge MC10H351MELG voltage level translator by Onsemi, designed to provide seamless communication between different voltage systems. With a focus on quality and reliability, Onsemi delivers exceptional performance in a compact package. This versatile device is ideal for a wide range of applications, offering customers the value of efficient signal translation with minimal power consumption. Upgrade your voltage translation needs with the MC10H351MELG and experience enhanced connectivity like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.25 V

Can handle high supply voltages, making it versatile for different applications.

No. of Functions: 4

Multiple functions in one device offer cost-saving and space-saving benefits.

Package Shape: RECTANGULAR

Convenient shape for PCB layout and design.

Power Supplies (V): 5

Compatible with standard 5V power supplies.

Maximum Operating Temperature: 75 °C

Can operate reliably in a wide range of temperatures.

Minimum Operating Temperature: 0 °C

Capable of functioning in low-temperature environments.

Output Characteristics: OPEN-EMITTER

Allows flexibility in connecting to different types of circuits.

Technology: ECL

Utilizes ECL technology for high-speed and low-power consumption.

Technical Specifications

Voltage Level Translators MC10H351MELG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.2 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.575 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.05 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

5.25 V

Minimum Supply Voltage-1:

4.75 V

Nominal Supply Voltage-1:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

5.275 mm

Trade Compliance

MC10H351MELG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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