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MC10H603FN

Onsemi

MC10H603FN by Onsemi

MC10H603FN by Onsemi is a voltage level translator with 9 functions, operating at 4.5-5.5V. It features ECL technology, 12ns max delay, and ECL to TTL translation capability. Ideal for applications requiring precise signal conversion in compact electronic systems.

Median Price

$3.500

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 556 parts In-Stock

1+ parts

-

100+ parts

$3.500

1k+ parts

$3.130

10k+ parts

$2.940

556

-

$3.500

$3.130

$2.940

Farnell

UK . 556 parts In-Stock

1+ parts

-

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$3.420

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556

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$3.420

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Verical

USA . 455 parts In-Stock

1+ parts

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$4.375

1k+ parts

$3.913

10k+ parts

$3.675

455

-

$4.375

$3.913

$3.675

Distributors (In-Stock)

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Vyrian

USA . 446 parts In-Stock

1+ parts

$3.420

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446

$3.420

-

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Digiode

USA . 1,477 parts In-Stock

1+ parts

$3.696

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1,477

$3.696

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Prism Electronics

USA . 1,724 parts In-Stock

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1,724

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Q Components

USA . 51 parts In-Stock

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J & M Industries LLC

USA . 30 parts In-Stock

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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LIBRA Elektronik GmbH

Germany . 10 parts In-Stock

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10

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Electronics Depot

USA . 6 parts In-Stock

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PC Components Company LLC

USA . 3 parts In-Stock

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Bristol Electronics

USA . 3 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 3 parts In-Stock

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Corohmni

South Africa . 109 parts In-Stock

1+ parts

$3.420

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109

$3.420

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Corphita

USA . 1,699 parts In-Stock

1+ parts

$3.501

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1,699

$3.501

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QUARKTWIN TECHNOLOGY LTD

USA . 20,605 parts In-Stock

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SupplyDigital Components

Austria . 8,290 parts In-Stock

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TANS Electronics

Latvia . 7,009 parts In-Stock

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Kulean Microsystems

USA . 4,736 parts In-Stock

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4,736

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Perfect Parts

USA . 1,903 parts In-Stock

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Metaverse IC Inc.

Canada . 635 parts In-Stock

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635

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UHIMA Technologies

Türkiye . 613 parts In-Stock

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613

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Continental Prestige Electronics

USA . 556 parts In-Stock

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$3.440

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556

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Problanco Electronics

Mexico . 412 parts In-Stock

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Microchip USA

USA . 371 parts In-Stock

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Upgrade your voltage level translation with the MC10H603FN from Onsemi. This high-quality chip carrier package provides 9 functions in a compact square shape, making it ideal for a wide range of applications. With a maximum supply voltage of 5.5V and 3-state output characteristics, this TTL translator ensures efficient signal conversion with precision and reliability. Trust Onsemi's expertise in semiconductor manufacturing to deliver superior performance and value to your electronic projects. Experience seamless integration and enhanced functionality with the MC10H603FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board.

Maximum Supply Voltage: 5.5 V

Can handle high voltage inputs, providing flexibility in design.

No. of Functions: 9

Offers multiple functions in one device, maximizing efficiency and saving space.

Package Shape: SQUARE

Square shape allows for compact placement on the circuit board.

Minimum Supply Voltage: 4.5 V

Can operate at low voltage levels, suitable for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, ensuring reliability in various environments.

Output Characteristics: 3-STATE

3-state output allows for high impedance state when disabled, providing flexibility in controlling the output.

Minimum Operating Temperature: 0 °C

Capable of operating in low-temperature conditions, making it suitable for diverse settings.

Terminal Finish: TIN LEAD

Tin lead finish ensures good electrical conductivity and solderability.

Width: 11.505 mm

Compact width allows for efficient use of space on the circuit board.

Output Polarity: COMPLEMENTARY

Complementary output signals provide a balanced response, minimizing errors in data transmission.

Peak Reflow Temperature °C: 235

Can withstand high reflow temperatures during the assembly process, ensuring durability.

Nominal Supply Voltage: 5 V

Stable supply voltage ensures consistent performance.

Maximum Delay: 12 ns

Low delay time ensures fast signal processing, critical for high-speed applications.

Interface IC Type: ECL TO TTL TRANSLATOR

Provides compatibility between different signal levels, enabling seamless communication between devices.

Technical Specifications

Voltage Level Translators MC10H603FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

12 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

LATCH

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H603FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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