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HCF4504M013TR

STMicroelectronics

HCF4504M013TR by STMicroelectronics

STMicroelectronics HCF4504M013TR is a 6-function voltage level translator with CMOS technology. It features a small outline package, Gull Wing terminals, and true output polarity. Ideal for TTL/CMOS to CMOS translation applications due to its compact size (9.9mm x 3.9mm) and dual terminal position design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,445 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,445

-

-

-

-

Digiode

USA . 2,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,284

-

-

-

-

Vyrian

USA . 1,731 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,731

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,194 parts In-Stock

1+ parts

$3.360

100+ parts

-

1k+ parts

$3.024

10k+ parts

-

2,194

$3.360

-

$3.024

-

MKK Technologies

India . 1,284 parts In-Stock

1+ parts

$6.318

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

$6.318

-

-

-

DigiPath Technology Company

USA . 1,284 parts In-Stock

1+ parts

$6.318

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

$6.318

-

-

-

Northwest PG Solutions

USA . 2,208 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,208

-

-

-

-

Corphita

USA . 1,651 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,651

-

-

-

-

Parana Technologies

USA . 618 parts In-Stock

1+ parts

-

100+ parts

$4.017

1k+ parts

-

10k+ parts

-

618

-

$4.017

-

-

Native Components

USA . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

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Overview

Elevate your voltage level translation needs with the HCF4504M013TR by STMicroelectronics. With a reputation for high-quality manufacturing, STMicroelectronics delivers a product that offers seamless integration and reliable performance. Perfect for a wide range of applications, this voltage level translator provides unparalleled value and benefits to customers seeking efficient and effective solutions. Say goodbye to compatibility issues and hello to smooth operation with the HCF4504M013TR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to moisture and chemicals, making the product suitable for a variety of environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and reducing costs.

No. of Functions: 6

Having multiple functions in a single device increases integration and saves board space, making the product versatile and cost-effective.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy for PCB layout and design, ensuring compatibility with existing systems.

No. of Terminals: 16

With 16 terminals, the product can support complex connectivity requirements, offering flexibility in use.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves board space and reduces overall size, ideal for applications with limited space.

Terminal Position: DUAL

Dual terminal position allows for easy connection and installation, enhancing user-friendly experience.

Maximum Seated Height: 1.75 mm

Low seated height enables the product to be compact and fit in tight spaces, suitable for compact electronic devices.

Width: 3.9 mm

Narrow width contributes to space-saving on the PCB, ideal for applications with size constraints.

Output Polarity: TRUE

True output polarity ensures accurate signal translation without distortion, guaranteeing reliable performance.

Length: 9.9 mm

Compact length makes the product suitable for compact designs and ensures efficient use of board space.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the product.

Terminal Form: GULL WING

Gull wing terminal form provides secure soldering and mechanical strength, ensuring reliable connections and durability.

Terminal Pitch: 1.27 mm

Standard terminal pitch facilitates easy assembly and compatibility with standard PCB designs, simplifying integration.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Designed for interfacing between different logic families, making it versatile and compatible with a wide range of systems and devices.

Technical Specifications

Voltage Level Translators HCF4504M013TR attributes and parameters. Explore more Voltage Level Translators devices from STMicroelectronics

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

HCF4504M013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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