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MC100ELT25MNR4

Onsemi

MC100ELT25MNR4 by Onsemi

MC100ELT25MNR4 by Onsemi is a voltage level translator with max supply voltage of 5.5V, operating temp range -40 to 85 °C, and max delay of 4.1ns. It's used for ECL to TTL translation in industrial applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,113 parts In-Stock

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Digiode

USA . 975 parts In-Stock

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Kulean Microsystems

USA . 6,906 parts In-Stock

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Problanco Electronics

Mexico . 2,190 parts In-Stock

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SupplyDigital Components

Austria . 997 parts In-Stock

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Corphita

USA . 722 parts In-Stock

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TANS Electronics

Latvia . 639 parts In-Stock

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Corohmni

South Africa . 228 parts In-Stock

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UHIMA Technologies

Türkiye . 10 parts In-Stock

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Overview

Unlock the potential of your electronic designs with the MC100ELT25MNR4 by Onsemi. This cutting-edge voltage level translator offers seamless integration and superior performance for a wide range of applications. With its high-quality construction and reliable design, this product ensures precision and efficiency, making it the perfect choice for demanding projects. Elevate your projects to new heights with the MC100ELT25MNR4 and experience the difference that Onsemi's expertise can bring to your work.

Feature Benefit Bullets

Surface Mount: YES

Easy and convenient integration into surface mount applications.

Maximum Supply Voltage: 5.5 V

Ability to handle high supply voltages, providing flexibility in different circuit setups.

Package Shape: SQUARE

Compact and space-saving design for efficient PCB layout.

Power Supplies (V): +-5

Support for dual power supplies, enabling compatibility with various system configurations.

No. of Terminals: 8

Sufficient number of terminals for connectivity and signal transfer.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Enhanced thermal performance and space efficiency for reliable operation in compact devices.

Minimum Supply Voltage: 4.5 V

Works effectively even at low supply voltages, ensuring reliable performance in different conditions.

Maximum Operating Temperature: 85 °C

Wide operating temperature range for versatility in various environments.

Minimum Operating Temperature: -40 °C

Ability to function in extreme cold temperatures, suitable for diverse applications.

Terminal Finish: TIN LEAD

Durable terminal finish for long-term reliability and robust connection.

Terminal Position: DUAL

Dual terminal position for flexibility in circuit design and connection options.

Maximum Seated Height: 1 mm

Low profile design for space-constrained applications.

Width: 2 mm

Compact width for efficient PCB layout and space-saving integration.

Output Polarity: TRUE

Accurate output polarity for precise signal conversion and transmission.

Length: 2 mm

Compact length for space-efficient placement on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial environments with varying temperature conditions.

Technology: ECL

Utilizes ECL technology for high-speed operation and low noise performance.

Terminal Form: NO LEAD

Lead-free terminal form for environmental sustainability and compliance.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage for compatibility with common power sources.

Nominal Negative Supply Voltage: -5 V

Support for negative supply voltage to accommodate various circuit requirements.

Maximum Delay: 4.1 ns

Low delay time for fast signal translation and efficient operation.

Terminal Pitch: 0.5 mm

Fine terminal pitch for precise and reliable connections.

Interface IC Type: ECL TO TTL TRANSLATOR

Specific IC type for accurately translating between ECL and TTL interfaces.

Technical Specifications

Voltage Level Translators MC100ELT25MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.1 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100ELT25MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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