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MC10EP90DTG

Onsemi

MC10EP90DTG by Onsemi

MC10EP90DTG by Onsemi is a voltage level translator with 3 functions, operating from -40 to 85 °C. It features ECL technology, PECL interface type, and a max delay of 0.34 ns. Ideal for industrial applications requiring precise signal translation in compact designs.

Median Price

$11.500

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 451 parts In-Stock

1+ parts

$7.097

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451

$7.097

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Chip1Stop

Japan . 21 parts In-Stock

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$9.990

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$9.990

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DigiKey

USA . 2 parts In-Stock

1+ parts

$18.660

100+ parts

$18.660

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$18.660

10k+ parts

$18.660

2

$18.660

$18.660

$18.660

$18.660

Rochester

USA . 38,521 parts In-Stock

1+ parts

-

100+ parts

$11.500

1k+ parts

$10.290

10k+ parts

$9.690

38,521

-

$11.500

$10.290

$9.690

Verical

USA . 10,200 parts In-Stock

1+ parts

-

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$14.375

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$12.863

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$12.113

10,200

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$14.375

$12.863

$12.113

Flip Electronics (Authorized)

USA . 360 parts In-Stock

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Digiode

USA . 474 parts In-Stock

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$6.488

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$6.488

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Vyrian

USA . 6,163 parts In-Stock

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Flip Electronics

USA . 360 parts In-Stock

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Distributors (Availability)

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Component Stockers USA

USA . 37,216 parts In-Stock

1+ parts

$5.120

100+ parts

$5.120

1k+ parts

$11.180

10k+ parts

$11.180

37,216

$5.120

$5.120

$11.180

$11.180

Ampacity Inc.

Singapore . 6,385 parts In-Stock

1+ parts

$5.600

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$5.600

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Corphita

USA . 1,788 parts In-Stock

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$6.147

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1,788

$6.147

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Corohmni

South Africa . 440 parts In-Stock

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$6.830

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440

$6.830

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Microchip USA

USA . 188 parts In-Stock

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$53.284

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188

$53.284

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Continental Prestige Electronics

USA . 28,367 parts In-Stock

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Problanco Electronics

Mexico . 6,299 parts In-Stock

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SupplyDigital Components

Austria . 3,257 parts In-Stock

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TANS Electronics

Latvia . 2,447 parts In-Stock

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Kulean Microsystems

USA . 2,073 parts In-Stock

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UHIMA Technologies

Türkiye . 793 parts In-Stock

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Kepictronics

USA . 155 parts In-Stock

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Perfect Parts

USA . 118 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Authorized Procurement Solutions

USA . 15 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC10EP90DTG by Onsemi. Known for their exceptional quality and expertise in semiconductor manufacturing, Onsemi delivers a cutting-edge solution that offers seamless translation between ECL and PECL interfaces. This versatile device is perfect for a wide range of applications, providing high-speed performance and reliable signal integrity. Experience the value and benefits of this innovative product, designed to meet the demands of industrial temperature grades with maximum efficiency and precision. Trust Onsemi to elevate your electronic designs to new heights with the MC10EP90DTG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to external elements, making it suitable for a wide range of applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this voltage level translator can handle a broad range of input voltages, providing flexibility in design.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliable performance even in demanding industrial environments.

Width: 4.4 mm

The compact width of 4.4mm allows for space-efficient integration into electronic circuits, ideal for applications with size constraints.

Technology: ECL

The use of ECL technology ensures high-speed operation and low power consumption, making this voltage level translator suitable for high-performance applications.

Technical Specifications

Voltage Level Translators MC10EP90DTG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

SAFETY CLAMP ON INPUTS, CAN ALSO OPERATE WITH -3V TO -5.5V IN NECL MODE

Maximum Delay:

.34 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-3.3 V

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

MC10EP90DTG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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