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SN100KT5564NT

Texas Instruments

SN100KT5564NT by Texas Instruments

SN100KT5564NT by Texas Instruments is a voltage level translator with 8 functions, operating temperature range of 0-85°C. It features 3-state output characteristics and inverted polarity, suitable for TTL to ECL transceiver applications. The package style is in-line rectangular with 24 terminals, dimensions of 31.64mm x 7.62mm x 5.08mm (LxWxH).

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,585 parts In-Stock

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8,585

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Digiode

USA . 2,906 parts In-Stock

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2,906

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 566 parts In-Stock

1+ parts

$3.500

100+ parts

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566

$3.500

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Parana Technologies

USA . 2,199 parts In-Stock

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$6.918

100+ parts

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$7.518

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2,199

$6.918

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$7.518

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AZTECH Wire

Italy . 668 parts In-Stock

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$7.326

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668

$7.326

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DigiPath Technology Company

USA . 1,246 parts In-Stock

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$7.618

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1,246

$7.618

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ChromeModa Solutions

Germany . 2,599 parts In-Stock

1+ parts

$7.773

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$6.374

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2,599

$7.773

$6.374

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IDEA Electronic Components Group

UK . 2,222 parts In-Stock

1+ parts

$7.773

100+ parts

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$6.996

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2,222

$7.773

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$6.996

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Corphita

USA . 287 parts In-Stock

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287

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Overview

Unleash the power of seamless voltage level translation with the SN100KT5564NT by Texas Instruments. Designed with precision and reliability in mind, this innovative voltage translator boasts 8 functions in a compact rectangular package. Whether you're working on industrial automation, telecommunications, or consumer electronics, this versatile solution offers unmatched value and performance. Say goodbye to compatibility issues and hello to smooth operation with the SN100KT5564NT. Elevate your designs and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material makes the product durable and reliable for long-term use.

No. of Functions: 8

The product offers the capability to perform 8 different functions, providing versatility and flexibility.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration and installation in various systems.

No. of Terminals: 24

With 24 terminals, the product can easily connect to multiple devices, expanding its utility and connectivity options.

Package Style (Meter): IN-LINE

The in-line package style enables a compact design, saving space and making it suitable for applications with limited room.

Maximum Operating Temperature: 85 °C

The product can operate at high temperatures up to 85°C, ensuring reliability in demanding environments.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, providing more options for customization.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, the product can function effectively in a wide range of temperature conditions.

Terminal Position: DUAL

The dual terminal position allows for a secure and stable connection, enhancing the product's reliability.

Maximum Seated Height: 5.08 mm

The low maximum seated height of 5.08 mm enables the product to fit into compact spaces or systems with height restrictions.

Width: 7.62 mm

The compact width of 7.62 mm makes the product suitable for applications where space is limited.

Output Polarity: INVERTED

The inverted output polarity provides versatility in signal processing and compatibility with various devices and systems.

Length: 31.64 mm

The length of 31.64 mm offers a balanced size for the product, making it suitable for a wide range of applications.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and reliable performance, making the product ideal for applications requiring fast data processing.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and stable connection, enhancing the product's reliability and longevity.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy and precise connections, ensuring efficient signal transmission and compatibility with standard connectors.

Interface IC Type: TTL TO ECL TRANSCEIVER

The interface IC type as a TTL to ECL transceiver offers seamless compatibility and efficient signal conversion between different logic levels, enhancing the product's versatility and utility.

Technical Specifications

Voltage Level Translators SN100KT5564NT attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN100KT5564NT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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