Loading...

MC10H352FNG

Onsemi

MC10H352FNG by Onsemi

MC10H352FNG by Onsemi is a voltage level translator with 4 functions, operating at 5V. It has a max supply voltage of 5.25V and min of 4.75V, with output polarity as complementary. This ECL technology chip carrier is used for TTL/CMOS to PECL translation in commercial applications.

Median Price

$10.530

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,426 parts In-Stock

1+ parts

-

100+ parts

$9.360

1k+ parts

$8.370

10k+ parts

$7.880

4,426

-

$9.360

$8.370

$7.880

Verical

USA . 2,448 parts In-Stock

1+ parts

-

100+ parts

$11.700

1k+ parts

$10.463

10k+ parts

$9.850

2,448

-

$11.700

$10.463

$9.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 365 parts In-Stock

1+ parts

$9.150

100+ parts

-

1k+ parts

-

10k+ parts

-

365

$9.150

-

-

-

Digiode

USA . 1,573 parts In-Stock

1+ parts

$9.899

100+ parts

-

1k+ parts

-

10k+ parts

-

1,573

$9.899

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 391 parts In-Stock

1+ parts

$9.150

100+ parts

-

1k+ parts

-

10k+ parts

-

391

$9.150

-

-

-

Corphita

USA . 2,003 parts In-Stock

1+ parts

$9.378

100+ parts

-

1k+ parts

-

10k+ parts

-

2,003

$9.378

-

-

-

SupplyDigital Components

Austria . 8,364 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,364

-

-

-

-

TANS Electronics

Latvia . 7,623 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,623

-

-

-

-

Kulean Microsystems

USA . 7,089 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,089

-

-

-

-

Problanco Electronics

Mexico . 5,504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,504

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,241 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,241

-

-

-

-

Continental Prestige Electronics

USA . 4,426 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,426

-

-

-

-

UHIMA Technologies

Türkiye . 947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

947

-

-

-

-

Microchip USA

USA . 183 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

183

-

-

-

-

Overview

Unlock the next level of voltage translation with the MC10H352FNG by Onsemi. This versatile chip carrier offers seamless compatibility with TTL/CMOS to PECL applications, delivering high-quality performance in a compact square package. With four functions packed into its sleek design, this voltage translator ensures optimal signal integrity and efficiency for your projects. Trust in Onsemi's reputation for excellence and innovation, and experience the enhanced value and benefits that the MC10H352FNG brings to your designs. Elevate your electronics with this reliable and cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material ensures durability and resistance to external factors, making the product reliable in various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and space.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage tolerance provides flexibility and compatibility with different power sources.

No. of Functions: 4

Multiple functions in a single device offer versatility and efficiency in voltage translation applications.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage ensures reliable operation even with lower power sources, enhancing overall performance.

Maximum Operating Temperature: 75 °C

High maximum operating temperature range allows for use in various conditions without risk of overheating or performance issues.

Output Characteristics: OPEN-EMITTER

Open-emitter output provides flexibility and compatibility for interfacing with different systems and components.

Width: 8.965 mm

Compact width allows for space-saving installation on circuit boards, especially in tight or crowded layouts.

Nominal Supply Voltage: 5 V

Standard 5V supply voltage ensures compatibility with common power sources and simplifies system integration.

Maximum Delay: 2 ns

Low maximum delay ensures fast and efficient voltage translation, reducing latency and improving overall system performance.

Technical Specifications

Voltage Level Translators MC10H352FNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H352FNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20