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MC100EP91DWR2

Onsemi

MC100EP91DWR2 by Onsemi

MC100EP91DWR2 by Onsemi is a voltage level translator with 3 functions, operating at -40 to 85 °C. It has a supply voltage range of 2.375-3.8 V and max delay of 0.75 ns. Ideal for ECL to PECL translation in industrial applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

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1k+

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Digiode

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Mexico . 5,808 parts In-Stock

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SupplyDigital Components

Austria . 2,635 parts In-Stock

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TANS Electronics

Latvia . 2,457 parts In-Stock

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Kulean Microsystems

USA . 2,050 parts In-Stock

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UHIMA Technologies

Türkiye . 800 parts In-Stock

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Corphita

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Overview

Enhance your voltage level translation needs with the MC100EP91DWR2 by Onsemi. Known for their superior quality and reliability, Onsemi delivers top-notch solutions for a wide range of applications. This voltage level translator offers seamless compatibility and efficient performance, making it an essential component for your electronics projects. Upgrade your systems with the MC100EP91DWR2 and experience enhanced functionality and precision like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Supports a wide range of supply voltages, making it versatile and compatible with various systems.

No. of Functions: 3

Having multiple functions in one device simplifies circuit design and reduces the need for additional components.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy placement and orientation on a circuit board for efficient design layout.

Power Supplies (V): 2.5/3.3,-3.3/-5

Offers flexibility in power supply options, accommodating different voltage requirements in a single component.

No. of Terminals: 20

Sufficient number of terminals for connectivity and interfacing with other components in a circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for densely populated circuit boards.

Minimum Supply Voltage: 2.375 V

Wide range of supply voltage support ensures compatibility with various systems and applications.

Maximum Operating Temperature: 85 °C

High operating temperature range allows for reliable performance in a variety of environmental conditions.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables operation in extreme cold conditions, increasing the product's versatility.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and conductivity for secure connections with other components.

Terminal Position: DUAL

Dual terminal position facilitates easy placement and soldering on the PCB, making installation straightforward.

Maximum Seated Height: 2.65 mm

Low seated height allows for compact design and clearance in space-constrained applications.

Width: 7.5 mm

Narrow width enables efficient layout and space-saving design on the circuit board.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures accurate signal transmission and compatibility with other components in the system.

Peak Reflow Temperature °C: 235

High peak reflow temperature tolerance ensures robust soldering during assembly processes.

Length: 12.8 mm

Optimal length for easy handling and placement on the PCB, contributing to efficient circuit board layout.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh environmental conditions, suitable for industrial applications.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical connection and ease of soldering during installation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage of 3.3V ensures consistent and reliable operation in various applications.

Maximum Delay: 0.75 ns

Minimal delay of 0.75ns guarantees fast signal transmission and efficient data processing within the circuit.

Terminal Pitch: 1.27 mm

Standard terminal pitch of 1.27mm allows for compatibility with common PCB layouts and easy integration.

Interface IC Type: ECL TO PECL TRANSLATOR

Specific interface IC type for translating ECL to PECL signals, ensuring seamless communication between different logic families.

Technical Specifications

Voltage Level Translators MC100EP91DWR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.75 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Power Supplies (V):

2.5/3.3,-3.3/-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Other Interface ICs

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

MC100EP91DWR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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