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SN100KT5563DW

Texas Instruments

SN100KT5563DW by Texas Instruments

SN100KT5563DW by Texas Instruments is an 8-function voltage level translator with a package style of small outline. Operating temperature ranges from 0°C to 85°C, with output polarity inverted and terminal pitch at 1.27mm. Ideal for TTL to ECL transceiver applications due to its ECL technology and surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,152 parts In-Stock

1+ parts

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7,152

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Digiode

USA . 1,537 parts In-Stock

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1,537

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,950 parts In-Stock

1+ parts

$2.124

100+ parts

-

1k+ parts

$2.638

10k+ parts

-

1,950

$2.124

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$2.638

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ChromeModa Solutions

Germany . 4,892 parts In-Stock

1+ parts

$2.387

100+ parts

$1.957

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4,892

$2.387

$1.957

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IDEA Electronic Components Group

UK . 2,093 parts In-Stock

1+ parts

$2.387

100+ parts

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$2.148

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2,093

$2.387

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$2.148

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AZTECH Wire

Italy . 281 parts In-Stock

1+ parts

$9.184

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281

$9.184

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One Stop Electronics

USA . 181 parts In-Stock

1+ parts

$29.500

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181

$29.500

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Corphita

USA . 3,198 parts In-Stock

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3,198

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DigiPath Technology Company

USA . 889 parts In-Stock

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$2.152

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889

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$2.152

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Overview

Discover the cutting-edge SN100KT5563DW by Texas Instruments, a top-tier voltage level translator designed for high-performance applications. With a reputation for excellence in semiconductor manufacturing, Texas Instruments delivers a quality product that exceeds industry standards. Ideal for a wide range of electronic devices, this voltage level translator offers seamless integration and precise signal conversion. Elevate your projects with the reliability, efficiency, and innovation that only Texas Instruments can provide. Choose the SN100KT5563DW for unmatched performance and value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy materials provide durability and protection to the internal components of the voltage level translator, making it suitable for various environmental conditions.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

No. of Functions: 8

With 8 functions, this voltage level translator offers versatile functionality and can support multiple tasks within a circuit.

Package Shape: RECTANGULAR

The rectangular package shape ensures compatibility with standard board layouts and facilitates efficient placement and routing of other components.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for interfacing with various devices and components in a circuit.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85°C ensures reliable performance even in demanding thermal conditions.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for flexible control of output signals, enabling high impedance when the output is disabled.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the voltage level translator can function effectively in a wide range of temperature environments.

Terminal Position: DUAL

The dual terminal position enhances connectivity options and facilitates easy integration with other components in a circuit.

Maximum Seated Height: 2.65 mm

The maximum seated height of 2.65 mm allows for compact and low-profile design, ideal for space-constrained applications.

Width: 7.5 mm

The moderate width of 7.5 mm strikes a balance between space efficiency and ease of handling during installation.

Output Polarity: INVERTED

The inverted output polarity is beneficial for applications that require signal inversion, providing greater flexibility in circuit design.

Length: 15.4 mm

The length of 15.4 mm offers a compact form factor, making it suitable for applications where space is a premium.

Technology: ECL

Utilizing ECL technology ensures high-speed operation and low power consumption, making the voltage level translator suitable for demanding applications.

Terminal Form: GULL WING

The gull wing terminal form simplifies soldering and improves mechanical strength, ensuring reliable connections in a circuit.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm provides compatibility with standard PCB layouts and allows for efficient routing of signals.

Interface IC Type: TTL TO ECL TRANSCEIVER

Compatible with TTL to ECL transceiver interface ICs, this voltage level translator enables seamless communication between different logic levels, enhancing circuit performance.

Technical Specifications

Voltage Level Translators SN100KT5563DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

SN100KT5563DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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