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MC100EPT24DTR2G

Onsemi

MC100EPT24DTR2G by Onsemi

MC100EPT24DTR2G by Onsemi is a voltage level translator with 8 terminals, operating at -40 to 85 °C. It has a supply voltage range of 3-3.6 V and offers 0.8 ns max delay. Ideal for converting LVTTL/LVCMOS signals to LVECL, this ECL technology-based device is suitable for industrial applications requiring precise signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,833 parts In-Stock

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Digiode

USA . 811 parts In-Stock

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Ampacity Inc.

Singapore . 1,452 parts In-Stock

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$1.500

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$1.500

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AZTECH Wire

Italy . 918 parts In-Stock

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$10.400

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Component Stockers USA

USA . 603 parts In-Stock

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$99.990

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603

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Kepictronics

USA . 7,520 parts In-Stock

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Microchip USA

USA . 4,202 parts In-Stock

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Kulean Microsystems

USA . 4,029 parts In-Stock

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TANS Electronics

Latvia . 2,594 parts In-Stock

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SupplyDigital Components

Austria . 1,819 parts In-Stock

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Corphita

USA . 1,724 parts In-Stock

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Problanco Electronics

Mexico . 1,314 parts In-Stock

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Corohmni

South Africa . 337 parts In-Stock

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UHIMA Technologies

Türkiye . 162 parts In-Stock

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Overview

Experience seamless voltage level translation with the MC100EPT24DTR2G by Onsemi. As a leading manufacturer in the field, Onsemi ensures top-notch quality and reliability in all their products. The MC100EPT24DTR2G is perfect for a wide range of applications, offering customers unparalleled value and performance. Say goodbye to compatibility issues and hello to smooth operation with this innovative voltage level translator. Trust Onsemi to deliver excellence in every product, making your projects easier and more efficient than ever before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy installation on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Suitable for applications requiring a maximum voltage of up to 3.6V.

Package Shape: SQUARE

Square shape provides efficient use of space on a circuit board.

Power Supplies (V): -4.5

Supports dual power supplies with a negative voltage of -4.5V.

No. of Terminals: 8

Provides multiple terminals for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design with a low profile and shrink pitch for space-saving installation.

Minimum Supply Voltage: 3 V

Operates efficiently with a minimum supply voltage of 3V.

Maximum Operating Temperature: 85 °C

Can withstand operation in high-temperature environments up to 85 °C.

Output Characteristics: OPEN-EMITTER

Open-emitter output provides versatility in connecting to different types of circuits.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme low-temperature conditions down to -40 °C.

Terminal Finish: Tin (Sn)

Tin finish on terminals ensures good electrical conductivity and solderability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in connection options.

Maximum Seated Height: 1.1 mm

Low seated height enables a compact and efficient PCB layout.

Width: 3 mm

Narrow width saves space on the circuit board.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures compatibility with different signal types.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for up to 40 seconds during soldering processes.

Peak Reflow Temperature °C: 260

Supports peak reflow temperature of 260 °C for soldering.

Length: 3 mm

Short length contributes to a space-efficient design on the PCB.

Temperature Grade: INDUSTRIAL

Designed for industrial applications with reliable performance in harsh environments.

Technology: ECL

Utilizes ECL technology for high-speed and low-power operation.

Terminal Form: GULL WING

Gull wing terminal form allows for easy and secure soldering to the PCB.

Nominal Supply Voltage: 3.3 V

Optimal nominal supply voltage of 3.3V for efficient performance.

Nominal Negative Supply Voltage: -3.3 V

Provides a negative supply voltage of -3.3V for dual power supply operation.

Maximum Delay: 0.8 ns

Minimal propagation delay of 0.8 nanoseconds for fast signal transmission.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm for precise connections on the PCB.

Interface IC Type: LVTTL/LVCMOS TO LVECL TRANSLATOR

Versatile interface IC type for translating between different logic voltage levels.

Technical Specifications

Voltage Level Translators MC100EPT24DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.8 ns

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-3.3 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

-4.5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3 mm

Trade Compliance

MC100EPT24DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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