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CD4504BF3A

Texas Instruments

CD4504BF3A by Texas Instruments

CD4504BF3A by Texas Instruments is a voltage level translator with 6 functions, operating b/w -55 to 125 °C. It has a max supply voltage of 18 V and consumes 0.018 mA current. Ideal for TTL/CMOS to CMOS translation in military-grade applications due to its push-pull output and through-hole terminal form.

Median Price

$14.626

Lifecycle Status

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12

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Arrow

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$17.022

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Avnet

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Vyrian

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TME

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NAC Semi

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Prism Electronics

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Corel Iberica Componentes, S.L.

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Mil-Aero Solutions, Inc.

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Native Components

USA . 231 parts In-Stock

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Northwest PG Solutions

USA . 728 parts In-Stock

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Parana Technologies

USA . 1,068 parts In-Stock

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$13.200

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$13.707

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DigiPath Technology Company

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IDEA Electronic Components Group

UK . 1,808 parts In-Stock

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ChromeModa Solutions

Germany . 39 parts In-Stock

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Lixinc

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Overview

Elevate your voltage level translations with the CD4504BF3A by Texas Instruments. Crafted with precision and expertise, this device offers seamless transitions between TTL/CMOS and CMOS signals, making it ideal for a wide range of applications. With its military-grade temperature grade and push-pull output characteristics, this translator ensures reliability and performance in even the most demanding conditions. Trust Texas Instruments to deliver quality and innovation, providing you with the value, benefits, and advantages you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides excellent durability and protection for the internal components, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 18 V

Capable of handling high voltage inputs, making it versatile for a wide range of applications.

No. of Functions: 6

Offers multiple functions in a single device, providing efficiency and saving space in circuit designs.

Package Shape: RECTANGULAR

Allows for easy integration into circuit layouts and ensures compatibility with standard PCB designs.

No. of Bits: 6

Provides precision and accuracy in voltage level translation, essential for reliable performance in digital systems.

Power Supplies (V): 5/15

Versatile power supply options cater to different voltage requirements, increasing flexibility in circuit design.

No. of Terminals: 16

Sufficient terminals for connecting to various components in a circuit, facilitating ease of installation and integration.

Package Style (Meter): IN-LINE

Compact in-line package style saves space on the PCB, ideal for applications with limited board real estate.

Minimum Supply Voltage: 5 V

Works efficiently with lower voltage inputs, suitable for a wide range of devices and applications.

Maximum Operating Temperature: 125 °C

Capable of operating in high-temperature environments, ensuring reliability and performance under challenging conditions.

Output Characteristics: PUSH-PULL

Provides both sourcing and sinking capabilities, making it suitable for driving a variety of loads in different configurations.

Minimum Operating Temperature: -55 °C

Capable of functioning in extreme cold temperatures, ensuring reliability in harsh environmental conditions.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity, making it easy to connect the device to the circuit.

Terminal Position: DUAL

Dual terminal position allows for easy connection in different orientations, providing flexibility in installation.

Maximum Seated Height: 5.08 mm

Low profile design saves space on the PCB, ideal for applications with height restrictions.

Width: 7.62 mm

Compact width facilitates easy integration into circuit layouts and ensures compatibility with standard board designs.

Output Polarity: TRUE

Correct output polarity ensures compatibility with various digital systems and minimizes the risk of errors in voltage translation.

Length: 19.56 mm

Optimal length for accommodating the necessary components and connections, ensuring efficient use of board space.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures reliable performance in rugged environments and critical applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast switching speeds, making it ideal for digital applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and mechanical stability, ensuring long-term reliability in the circuit.

Maximum Supply Current: 0.018 mA

Low supply current consumption minimizes power usage, suitable for battery-powered devices and energy-efficient applications.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of digital systems and devices, simplifying integration.

Nominal Supply Voltage: 10 V

Optimal nominal supply voltage for efficient operation and compatibility with common power sources.

Maximum Delay: 550 ns

Fast response time with minimal delay ensures quick and reliable voltage level translation, essential for high-speed digital applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch for easy integration into common PCB layouts, ensuring compatibility and ease of connection.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Specific interface IC type for translating TTL/CMOS signals to CMOS voltage levels, ensuring seamless communication between different logic families.

Technical Specifications

Voltage Level Translators CD4504BF3A attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

550 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

No. of Bits:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

PUSH-PULL

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Level Translators

Maximum Supply Current:

.018 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

10 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD4504BF3A Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-304-9166, 5962013049166

NIIN

013049166

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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