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CD4504BMTG4

Texas Instruments

CD4504BMTG4 by Texas Instruments

CD4504BMTG4 by Texas Instruments is a voltage level translator with 6 functions, operating b/w -55 to 125 °C. It has a max supply voltage of 18 V and min of 5 V, suitable for TTL/CMOS to CMOS translation in military-grade applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,909 parts In-Stock

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Digiode

USA . 2,578 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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AZTECH Wire

Italy . 251 parts In-Stock

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$8.752

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$8.752

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Parana Technologies

USA . 2,029 parts In-Stock

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$9.154

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$9.803

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DigiPath Technology Company

USA . 523 parts In-Stock

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$10.079

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523

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IDEA Electronic Components Group

UK . 415 parts In-Stock

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$10.285

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$9.771

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$9.256

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415

$10.285

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$9.256

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ChromeModa Solutions

Germany . 93 parts In-Stock

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$10.285

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$8.434

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One Stop Electronics

USA . 1,115 parts In-Stock

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$22.500

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Ampacity Inc.

Singapore . 1,602 parts In-Stock

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$44.500

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Corphita

USA . 4,525 parts In-Stock

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Unlock new possibilities with the CD4504BMTG4 from Texas Instruments, a leading manufacturer known for quality and reliability. This voltage level translator is a game-changer in various applications, offering seamless voltage translation between different systems. With its compact design and advanced technology, this product delivers unparalleled performance and efficiency, making it a valuable asset for your projects. Experience the benefits of seamless voltage translation with the CD4504BMTG4 and take your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Maximum Supply Voltage: 18 V

Can handle higher voltage levels, making it suitable for a wide range of applications.

Minimum Operating Temperature: -55 °C

Can operate in very low temperature environments, increasing its versatility.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it efficient and reliable.

Maximum Delay: 550 ns

Provides fast signal translation, ensuring quick response times in data transmission.

Technical Specifications

Voltage Level Translators CD4504BMTG4 attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

550 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5 V

Nominal Supply Voltage:

10 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4504BMTG4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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