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MC100LVELT23MNR4

Onsemi

MC100LVELT23MNR4 by Onsemi

MC100LVELT23MNR4 by Onsemi is a voltage level translator with 2 functions, operating at 3.3V. It offers fast performance with a max delay of 2.5ns and interfaces PECL to TTL signals efficiently. Ideal for industrial applications requiring precise signal translation in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 849 parts In-Stock

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849

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Digiode

USA . 473 parts In-Stock

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473

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Problanco Electronics

Mexico . 6,036 parts In-Stock

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6,036

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SupplyDigital Components

Austria . 5,418 parts In-Stock

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TANS Electronics

Latvia . 4,792 parts In-Stock

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Corphita

USA . 2,355 parts In-Stock

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Kulean Microsystems

USA . 1,478 parts In-Stock

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UHIMA Technologies

Türkiye . 911 parts In-Stock

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911

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Corohmni

South Africa . 437 parts In-Stock

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Overview

Elevate your voltage level translation needs with the MC100LVELT23MNR4 by Onsemi. This innovative product boasts top-notch quality and reliability, thanks to its renowned manufacturer. Ideal for a wide range of applications, this voltage level translator offers exceptional value, benefits, and advantages to customers seeking seamless and efficient operation. Say goodbye to compatibility issues and hello to smooth performance with the MC100LVELT23MNR4.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy installation and soldering onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Can handle a higher voltage input, providing flexibility in various applications.

No. of Functions: 2

Offers dual functionality in a single component, reducing the need for multiple components.

Package Shape: SQUARE

Square package shape helps in easier PCB layout and compact design.

Power Supplies (V): 3.3

Operates within standard power supply voltage range, suitable for many applications.

No. of Terminals: 8

Provides multiple connection points for flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package design saves space on the PCB and allows for efficient heat dissipation.

Minimum Supply Voltage: 3 V

Can operate at relatively low supply voltage, suitable for low-power applications.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures, ideal for industrial environments.

Minimum Operating Temperature: -40 °C

Operates effectively in cold temperature conditions as well.

Terminal Finish: TIN LEAD

Provides good solderability and conductivity for reliable connections.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options and ease of connection.

Maximum Seated Height: 1 mm

Low profile design helps in space-constrained applications.

Width: 2 mm

Compact width enables efficient use of board space.

Output Polarity: TRUE

Output polarity remains consistent for easy integration with other components.

Length: 2 mm

Short length helps in compact PCB layout.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperature conditions.

Technology: ECL

Uses Emitter-Coupled Logic technology for high-speed operation.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations.

Nominal Supply Voltage: 3.3 V

Operates at the standard voltage level, ensuring compatibility with other components.

Maximum Delay: 2.5 ns

Low delay time ensures fast signal translation, suitable for high-speed applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density mounting on the PCB.

Interface IC Type: PECL TO TTL TRANSLATOR

Supports translation between PECL and TTL signal levels, enabling communication between different devices.

Technical Specifications

Voltage Level Translators MC100LVELT23MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.5 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC100LVELT23MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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