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MC10H607FNR2

Onsemi

MC10H607FNR2 by Onsemi

MC10H607FNR2 by Onsemi is a voltage level translator with 6 functions, operating at 5V. It features PECL to TTL translation, with a max delay of 8.3ns. Ideal for applications requiring true output polarity and ECL technology in a compact chip carrier package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,049 parts In-Stock

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2,049

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Vyrian

USA . 676 parts In-Stock

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676

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Distributors (Availability)

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TANS Electronics

Latvia . 8,058 parts In-Stock

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8,058

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Problanco Electronics

Mexico . 6,676 parts In-Stock

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6,676

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SupplyDigital Components

Austria . 2,097 parts In-Stock

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Kulean Microsystems

USA . 1,177 parts In-Stock

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1,177

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UHIMA Technologies

Türkiye . 533 parts In-Stock

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533

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Corohmni

South Africa . 254 parts In-Stock

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254

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Corphita

USA . 169 parts In-Stock

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Overview

Unlock unlimited possibilities with the MC10H607FNR2 by Onsemi, a top-tier manufacturer known for cutting-edge technology and reliability. This voltage level translator is perfect for a wide range of applications, offering seamless integration and efficient performance. Experience the value of high-quality design, superior functionality, and unparalleled convenience with this innovative product. Trust Onsemi to deliver excellence every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability of the product.

Surface Mount: YES

Allows for easy and convenient mounting on PCBs.

Maximum Supply Voltage: 5.25 V

Allows for compatibility with devices that require higher supply voltages.

No. of Functions: 6

Provides flexibility and versatility in voltage level translation tasks.

Package Shape: SQUARE

Helps in easy identification and installation on PCBs.

Power Supplies (V): 5

Utilizes standard power supply voltage for smooth operation.

No. of Terminals: 28

Offers ample connectivity options for various circuits and components.

Package Style (Meter): CHIP CARRIER

Ensures compact and efficient packaging of the product.

Minimum Supply Voltage: 4.75 V

Works effectively with devices that require lower supply voltages.

Maximum Operating Temperature: 85 °C

Can withstand higher operating temperatures without compromising performance.

Minimum Operating Temperature: 0 °C

Ensures reliable operation even in low-temperature environments.

Terminal Finish: TIN LEAD

Provides good electrical conductivity and resistance to corrosion.

Terminal Position: QUAD

Offers a standardized terminal arrangement for easy integration with other components.

Maximum Seated Height: 4.57 mm

Helps in maintaining a low-profile design for space-constrained applications.

Width: 11.505 mm

Compact width makes it suitable for tight PCB layouts.

Output Polarity: TRUE

Delivers accurate and consistent output signals.

Length: 11.505 mm

Compact length for efficient PCB utilization.

Technology: ECL

Utilizes ECL technology for high-speed and high-performance operation.

Terminal Form: J BEND

Facilitates easy soldering and connection of terminals.

Output Latch/Register: REGISTER

Offers signal stability and reliability with output registers.

Nominal Supply Voltage: 5 V

Standard supply voltage for compatibility with a wide range of devices.

Maximum Delay: 8.3 ns

Low delay ensures quick voltage level translations for efficient operation.

Terminal Pitch: 1.27 mm

Standardized terminal pitch for easy connectivity and compatibility.

Interface IC Type: PECL TO TTL TRANSLATOR

Specifically designed for translating voltage levels between PECL and TTL interfaces.

Technical Specifications

Voltage Level Translators MC10H607FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

8.3 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

0 Cel

Output Latch/Register:

REGISTER

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H607FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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