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MC100LVEL91DWG

Onsemi

MC100LVEL91DWG by Onsemi

MC100LVEL91DWG by Onsemi is a PECL to ECL translator with 3 functions, operating at -40 to 85 °C. It has a voltage range of +-3.3/-5 V and delay of 0.76 ns, suitable for industrial applications requiring high-speed signal translation in compact designs.

Median Price

$9.828

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5 parts In-Stock

1+ parts

$4.276

100+ parts

-

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5

$4.276

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RS (Exports)

UK . 76 parts In-Stock

1+ parts

$9.828

100+ parts

$8.576

1k+ parts

$8.184

10k+ parts

-

76

$9.828

$8.576

$8.184

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DigiKey

USA . 209 parts In-Stock

1+ parts

$10.160

100+ parts

$7.166

1k+ parts

$6.282

10k+ parts

$6.146

209

$10.160

$7.166

$6.282

$6.146

Chip1Stop

Japan . 2 parts In-Stock

1+ parts

$21.000

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$21.000

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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3,000

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Verical

USA . 1,520 parts In-Stock

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$5.648

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1,520

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$5.648

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Distributors (In-Stock)

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Digiode

USA . 1,596 parts In-Stock

1+ parts

$9.337

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1,596

$9.337

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Flip Electronics

USA . 4,520 parts In-Stock

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4,520

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Vyrian

USA . 3,760 parts In-Stock

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3,760

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Mil-Aero Solutions, Inc.

USA . 1,419 parts In-Stock

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Speed Components Ltd

Israel . 103 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 28 parts In-Stock

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Connector Distribution Corp

USA . 4 parts In-Stock

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Right Parts Inc.

USA . 4 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 50 parts In-Stock

1+ parts

$5.623

100+ parts

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50

$5.623

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Corphita

USA . 2,157 parts In-Stock

1+ parts

$8.845

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2,157

$8.845

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Microchip USA

USA . 2,818 parts In-Stock

1+ parts

$31.724

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2,818

$31.724

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Lixinc

USA . 13,221 parts In-Stock

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SupplyDigital Components

Austria . 7,466 parts In-Stock

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Kulean Microsystems

USA . 6,739 parts In-Stock

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6,739

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QUARKTWIN TECHNOLOGY LTD

USA . 4,313 parts In-Stock

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TANS Electronics

Latvia . 2,447 parts In-Stock

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UHIMA Technologies

Türkiye . 575 parts In-Stock

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575

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Perfect Parts

USA . 181 parts In-Stock

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Problanco Electronics

Mexico . 106 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Elevate your voltage level translation needs with the MC100LVEL91DWG by Onsemi. Crafted with precision and expertise, this device is designed to provide seamless functionality and reliability in a variety of applications. From industrial automation to telecommunications, this voltage level translator offers unparalleled performance and efficiency. Trust in Onsemi's reputation for excellence and innovation, and experience the value and benefits that the MC100LVEL91DWG brings to your projects. Choose quality, choose Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the voltage level translator.

Maximum Supply Voltage: 3.8 V

Allows for compatibility with systems requiring voltage levels up to 3.8V.

No. of Functions: 3

Offers versatility and multiple functions in a single component, reducing the need for additional components.

Minimum Operating Temperature: -40 °C

Ensures reliable performance even in very low temperature environments.

Maximum Operating Temperature: 85 °C

Can withstand high operating temperatures without compromising performance.

Nominal Supply Voltage: 3.3 V

Ideal for applications requiring a stable and standard supply voltage of 3.3V.

Maximum Delay: 0.76 ns

Provides fast signal conversion with minimal delay, making it suitable for high-speed applications.

Technical Specifications

Voltage Level Translators MC100LVEL91DWG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.76 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Bits:

1

No. of Functions:

3

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-3.3/-5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

MC100LVEL91DWG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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