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100324QIX

Onsemi

100324QIX by Onsemi

The Onsemi 100324QIX is a voltage level translator with 6 bits and 28 terminals. It operates b/w -40 to 85 °C, with a supply voltage range of 4.5V to 5.5V. Ideal for TTL to ECL translation in industrial applications due to its compact chip carrier package and low delay of 2.8 ns.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Cyclops Electronics Ltd

UK . 7,500 parts In-Stock

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Anansix

USA . 2,898 parts In-Stock

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Digiode

USA . 2,783 parts In-Stock

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Vyrian

USA . 439 parts In-Stock

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Resion

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Lantek

USA . 268 parts In-Stock

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268

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Bristol Electronics

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Mil-Aero Solutions, Inc.

USA . 50 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 13,294 parts In-Stock

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Metaverse IC Inc.

Canada . 7,500 parts In-Stock

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Assy Fe

Spain . 7,500 parts In-Stock

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Kulean Microsystems

USA . 5,814 parts In-Stock

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SupplyDigital Components

Austria . 4,655 parts In-Stock

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Microchip USA

USA . 4,649 parts In-Stock

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 2,942 parts In-Stock

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Glotronic Ltd.

UK . 2,300 parts In-Stock

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Infinite Electronics LLP (Excess)

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Northwest PG Solutions

USA . 1,962 parts In-Stock

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Problanco Electronics

Mexico . 1,027 parts In-Stock

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UHIMA Technologies

Türkiye . 955 parts In-Stock

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Corphita

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GreenTree Electronics

Israel . 268 parts In-Stock

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Corohmni

South Africa . 256 parts In-Stock

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Supply Digital

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Native Components

USA . 164 parts In-Stock

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$3.804

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Overview

Unlock a world of seamless voltage translation with the 100324QIX by Onsemi. As a trusted manufacturer of high-quality components, Onsemi brings you a voltage level translator that is perfect for a wide range of applications. From industrial to consumer electronics, this versatile chip carrier offers reliable performance and exceptional value. Say goodbye to compatibility issues and hello to smoother operation with the 100324QIX - the ultimate solution for your voltage translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material makes the product easy to handle and long-lasting.

Surface Mount: YES

Easy to install and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

Can handle high voltage levels, making it versatile for various applications.

Package Shape: SQUARE

Compact shape helps in efficient PCB layout and space-saving.

No. of Bits: 6

Provides a good range of voltage levels for translation.

No. of Terminals: 28

Provides multiple connection points for easy integration into the circuit.

Package Style (Meter): CHIP CARRIER

High-density packaging allows for more functionality in a small footprint.

Minimum Supply Voltage: 4.5 V

Can operate in a wide range of voltage levels, increasing flexibility.

Maximum Operating Temperature: 85 °C

Suitable for industrial applications where high temperatures are common.

Minimum Operating Temperature: -40 °C

Can withstand harsh environments and extreme cold temperatures.

Terminal Position: QUAD

Quad terminal arrangement facilitates easy connections and enhances stability.

Maximum Seated Height: 4.57 mm

Low profile design helps in compact PCB assembly.

Width: 11.43 mm

Optimal width for easy integration into the circuit design.

Output Polarity: COMPLEMENTARY

Provides both positive and negative outputs for versatile application requirements.

Length: 11.43 mm

Balanced length for uniform footprint on the PCB.

Temperature Grade: INDUSTRIAL

Meets industrial standards for temperature range and reliability.

Technology: ECL100K

Utilizes advanced technology for efficient voltage level translation.

Terminal Form: J BEND

J-bend terminals make soldering easy and secure for robust connections.

Maximum Supply Current: 38 mA

Low power consumption for energy-efficient operation.

Nominal Supply Voltage: 5 V

Standard voltage level for compatibility with common systems.

Nominal Negative Supply Voltage: -5 V

Enables dual voltage operation for diverse circuit requirements.

Maximum Delay: 2.8 ns

Fast signal propagation with minimal delay for efficient data transmission.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for easy PCB layout and connections.

Interface IC Type: TTL TO ECL TRANSLATOR

Specifically designed for translating signals between TTL and ECL logic levels.

Technical Specifications

Voltage Level Translators 100324QIX attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.8 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.43 mm

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

6

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Maximum Seated Height:

4.57 mm

Maximum Supply Current:

38 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

100324QIX Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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