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MC10H424FNR2

Onsemi

MC10H424FNR2 by Onsemi

MC10H424FNR2 by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max supply and -5.2V min supply. It features TTL to ECL translation, suitable for applications requiring fast response times in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,098 parts In-Stock

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Vyrian

USA . 725 parts In-Stock

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725

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Problanco Electronics

Mexico . 8,252 parts In-Stock

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8,252

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TANS Electronics

Latvia . 2,338 parts In-Stock

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SupplyDigital Components

Austria . 1,764 parts In-Stock

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Kulean Microsystems

USA . 1,361 parts In-Stock

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Corphita

USA . 1,282 parts In-Stock

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Corohmni

South Africa . 87 parts In-Stock

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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Overview

Upgrade your electronic designs with the MC10H424FNR2 by Onsemi, a high-quality voltage level translator that offers reliable performance and seamless integration. Manufactured by Onsemi, a trusted leader in semiconductor technology, this chip carrier package delivers superior voltage translation for your applications. With a wide operating temperature range and multiple functions, this versatile component ensures optimal signal integrity and efficiency. Experience the value and benefits of using the MC10H424FNR2 in your projects and unlock new possibilities in electronic design.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and resistant material for the package body ensures reliability and longevity of the product.

Maximum Supply Voltage: 5.25 V

Allows for stable operation within a range of voltage inputs, making the product versatile and compatible with various systems.

No. of Functions: 4

Multiple functions provide flexibility and efficiency in voltage translation tasks, reducing the need for additional components.

Package Shape: SQUARE

Square package shape allows for easy placement on circuit boards, optimizing space and layout design.

Power Supplies (V): 5,-5.2

Supports both positive and negative power supplies, making it suitable for a wide range of applications and configurations.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures reliability and performance even in demanding environmental conditions.

Output Characteristics: OPEN-EMITTER

Open-emitter output characteristics provide flexibility and compatibility with different types of circuits and components.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making the product efficient and reliable in signal translation.

Technical Specifications

Voltage Level Translators MC10H424FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.3 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

8.965 mm

Trade Compliance

MC10H424FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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