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SN10KHT5564NT

Texas Instruments

SN10KHT5564NT by Texas Instruments

SN10KHT5564NT by Texas Instruments is an 8-function voltage level translator with 24 terminals in a rectangular package. It operates b/w 0°C to 75°C, featuring TTL to ECL transceiver interface IC type and inverted output polarity. Ideal for applications requiring fast signal translation and compatibility across different logic levels.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,142 parts In-Stock

1+ parts

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4,142

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Digiode

USA . 3,383 parts In-Stock

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3,383

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 873 parts In-Stock

1+ parts

$4.009

100+ parts

-

1k+ parts

$4.474

10k+ parts

-

873

$4.009

-

$4.474

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ChromeModa Solutions

Germany . 2,074 parts In-Stock

1+ parts

$4.505

100+ parts

$3.694

1k+ parts

-

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2,074

$4.505

$3.694

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IDEA Electronic Components Group

UK . 211 parts In-Stock

1+ parts

$4.505

100+ parts

-

1k+ parts

$4.054

10k+ parts

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211

$4.505

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$4.054

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AZTECH Wire

Italy . 341 parts In-Stock

1+ parts

$14.814

100+ parts

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341

$14.814

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One Stop Electronics

USA . 178 parts In-Stock

1+ parts

$32.500

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178

$32.500

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Corphita

USA . 4,737 parts In-Stock

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4,737

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DigiPath Technology Company

USA . 780 parts In-Stock

1+ parts

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100+ parts

$4.062

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780

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$4.062

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Overview

Unlock seamless voltage level translation with the SN10KHT5564NT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This voltage level translator is perfect for applications requiring precise signal conversion, offering customers unparalleled value and benefits. Say goodbye to compatibility issues and experience smooth operation with this advanced technology. Elevate your projects with the SN10KHT5564NT and discover the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and can withstand various operating conditions, making the product reliable and long-lasting.

No. of Functions: 8

Having 8 functions allows the product to handle multiple voltage translation tasks efficiently.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to integrate the product into different circuit designs and layouts.

No. of Terminals: 24

With 24 terminals, the product offers flexibility in connection options, enabling versatile use cases.

Package Style (Meter): IN-LINE

The in-line package style helps in easy installation and space-saving on the circuit board.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75°C, the product can perform reliably even in high-temperature environments.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high impedance state, providing better control and flexibility in the signal flow.

Minimum Operating Temperature: 0 °C

The product can operate at a minimum temperature of 0°C, ensuring functionality in a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal position offers redundancy and better connectivity options, enhancing the reliability of the product.

Maximum Seated Height: 5.08 mm

The low seated height makes it suitable for applications with space constraints, ensuring ease of integration.

Width: 7.62 mm

The compact width of the product allows for efficient use of space on the circuit board.

Output Polarity: INVERTED

The inverted output polarity ensures compatibility with systems that require inverted logic levels.

Length: 31.64 mm

The length of the product provides sufficient space for accommodating all functions and terminals, making it versatile in various applications.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures reliable operation in a wide range of temperature environments, expanding the product's utility.

Technology: ECL

ECL technology offers high-speed performance, making the product suitable for applications that require fast signal transmission.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure and stable connections, reducing the risk of disconnection in demanding operating conditions.

Maximum Delay: 0 ns

The 0 ns maximum delay ensures minimal signal delay, making the product ideal for time-sensitive applications.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard connectors and sockets, facilitating easy integration.

Interface IC Type: TTL TO ECL TRANSCEIVER

The interface IC type allows seamless communication between TTL and ECL systems, enabling the product to act as a reliable voltage level translator.

Technical Specifications

Voltage Level Translators SN10KHT5564NT attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN10KHT5564NT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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