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SN100KT5543DW

Texas Instruments

SN100KT5543DW by Texas Instruments

SN100KT5543DW by Texas Instruments is a voltage level translator with 8 functions, operating at supply voltages of 4.5V to 5.5V. It features a small outline package style and Gull Wing terminal form, suitable for TTL to ECL translation applications with a max delay of 3.6ns at commercial temperature grades.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,767 parts In-Stock

1+ parts

-

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3,767

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Digiode

USA . 2,038 parts In-Stock

1+ parts

-

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2,038

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 477 parts In-Stock

1+ parts

$7.367

100+ parts

-

1k+ parts

$7.860

10k+ parts

-

477

$7.367

-

$7.860

-

DigiPath Technology Company

USA . 2,228 parts In-Stock

1+ parts

$8.111

100+ parts

$7.463

1k+ parts

-

10k+ parts

-

2,228

$8.111

$7.463

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ChromeModa Solutions

Germany . 4,100 parts In-Stock

1+ parts

$8.277

100+ parts

$6.787

1k+ parts

-

10k+ parts

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4,100

$8.277

$6.787

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IDEA Electronic Components Group

UK . 2,025 parts In-Stock

1+ parts

$8.277

100+ parts

$7.863

1k+ parts

$7.449

10k+ parts

-

2,025

$8.277

$7.863

$7.449

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AZTECH Wire

Italy . 257 parts In-Stock

1+ parts

$19.126

100+ parts

-

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257

$19.126

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One Stop Electronics

USA . 917 parts In-Stock

1+ parts

$43.500

100+ parts

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917

$43.500

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Corphita

USA . 1,369 parts In-Stock

1+ parts

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1,369

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Overview

Elevate your voltage level translation needs with the SN100KT5543DW by Texas Instruments. Known for their superior quality and reliability, Texas Instruments brings you a versatile solution for various applications in the voltage level translator category. Experience seamless signal conversion and smooth communication between different voltage domains with this innovative product. Enjoy the benefits of precise output characteristics, true output polarity, and quick response time, all packaged in a compact and convenient form factor. Trust Texas Instruments to deliver unmatched value and performance with the SN100KT5543DW.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the voltage level translator.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, making it suitable for a wide range of applications.

Package Shape: RECTANGULAR

Facilitates easy installation in electronic circuit boards and compact designs.

Minimum Operating Temperature: 0 °C

Can operate efficiently in low-temperature environments.

Maximum Delay: 3.6 ns

Provides fast signal translation, minimizing latency in data transmission.

Technical Specifications

Voltage Level Translators SN100KT5543DW attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

3.6 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G24

Length:

15.4 mm

Nominal Negative Supply Voltage:

-4.5 V

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

SN100KT5543DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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