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NLV14504BDTR2G

Onsemi

NLV14504BDTR2G by Onsemi

NLV14504BDTR2G by Onsemi is a voltage level translator with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 3-18 V and max delay of 550 ns. Ideal for military-grade applications requiring TTL/CMOS to CMOS translation in compact spaces.

Median Price

$0.407

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3,231 parts In-Stock

1+ parts

$1.400

100+ parts

$0.389

1k+ parts

$0.346

10k+ parts

$0.295

3,231

$1.400

$0.389

$0.346

$0.295

Rochester

USA . 9,642 parts In-Stock

1+ parts

-

100+ parts

$0.341

1k+ parts

$0.283

10k+ parts

$0.252

9,642

-

$0.341

$0.283

$0.252

DigiKey

USA . 9,642 parts In-Stock

1+ parts

-

100+ parts

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$0.430

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-

9,642

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-

$0.430

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Verical

USA . 3,913 parts In-Stock

1+ parts

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$0.384

10k+ parts

$0.354

3,913

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-

$0.384

$0.354

Distributors (In-Stock)

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Digiode

USA . 1,761 parts In-Stock

1+ parts

$0.265

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1,761

$0.265

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Vyrian

USA . 1,970 parts In-Stock

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$0.279

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1,970

$0.279

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Flip Electronics

USA . 5,000 parts In-Stock

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5,000

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NAC Semi

USA . 2,500 parts In-Stock

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$0.383

2,500

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$0.383

Distributors (Availability)

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Corphita

USA . 241 parts In-Stock

1+ parts

$0.251

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241

$0.251

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Corohmni

South Africa . 69 parts In-Stock

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$0.279

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69

$0.279

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Vigor

Singapore . 307 parts In-Stock

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$0.890

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307

$0.890

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QUARKTWIN TECHNOLOGY LTD

USA . 24,143 parts In-Stock

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Kulean Microsystems

USA . 7,516 parts In-Stock

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Problanco Electronics

Mexico . 5,805 parts In-Stock

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Microchip USA

USA . 2,040 parts In-Stock

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UHIMA Technologies

Türkiye . 957 parts In-Stock

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SupplyDigital Components

Austria . 508 parts In-Stock

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TANS Electronics

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Overview

Elevate your voltage level translation needs with the NLV14504BDTR2G by Onsemi. Crafted with precision and quality, this voltage level translator offers seamless interface communication in a compact package, making it ideal for a wide range of applications. With a maximum supply voltage of 18V and a minimum operating temperature of -55 °C, this device ensures reliable performance even in the harshest conditions. Experience the value and benefits of this product as it effortlessly translates TTL/CMOS to CMOS signals, providing customers with a reliable and efficient solution for their voltage level translation requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and reliable housing for the voltage level translator, ensuring long-term performance.

Surface Mount: YES

Allows for easy and convenient installation on a circuit board, saving space and simplifying assembly.

Maximum Supply Voltage: 18 V

Can handle a wide range of input voltages, increasing versatility and compatibility with different systems.

No. of Functions: 6

Offers multiple functions in a single component, reducing the need for additional components and simplifying circuit design.

Screening Level: AEC-Q100

Meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Fits easily on a circuit board and allows for efficient use of space.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package design saves space on the circuit board and allows for high-density mounting.

Minimum Supply Voltage: 3 V

Has a low minimum supply voltage requirement, making it suitable for use in low-power applications.

Maximum Operating Temperature: 125 °C

Can operate at high temperatures without performance degradation, suitable for demanding environments.

Minimum Operating Temperature: -55 °C

Operates reliably in cold temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides corrosion resistance and ensures reliable electrical connections over time.

Width: 4.4 mm

Compact width allows for efficient use of space on the circuit board.

Output Polarity: TRUE

Ensures correct polarity of the output signal, preventing errors in data transmission.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high speed operation.

Maximum Supply Current: 6 mA

Has low power consumption, reducing energy usage in the system.

Nominal Supply Voltage: 5 V

Compatible with common supply voltages, making it easy to integrate into existing systems.

Maximum Delay: 550 ns

Provides fast switching speeds, ensuring timely data transmission in high-speed applications.

Terminal Pitch: 0.65 mm

Compact terminal pitch saves space on the circuit board.

Interface IC Type: TTL/CMOS TO CMOS TRANSLATOR

Facilitates signal translation between different logic levels, enabling communication between different components.

Technical Specifications

Voltage Level Translators NLV14504BDTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

550 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

6 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4.4 mm

Trade Compliance

NLV14504BDTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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