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MC10H680FN

Onsemi

MC10H680FN by Onsemi

MC10H680FN by Onsemi is a voltage level translator with 4 functions, operating at 5.5V max and 4.5V min supply voltages. It features ECL technology, 3-STATE output characteristics, and is used as a TTL to ECL transceiver in commercial extended temperature applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 2,135 parts In-Stock

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Vyrian

USA . 802 parts In-Stock

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Prism Electronics

USA . 43 parts In-Stock

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Electronic Expediters

USA . 15 parts In-Stock

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Kulean Microsystems

USA . 8,352 parts In-Stock

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TANS Electronics

Latvia . 5,571 parts In-Stock

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SupplyDigital Components

Austria . 4,873 parts In-Stock

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Problanco Electronics

Mexico . 4,116 parts In-Stock

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Corphita

USA . 844 parts In-Stock

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Microchip USA

USA . 287 parts In-Stock

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Corohmni

South Africa . 213 parts In-Stock

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UHIMA Technologies

Türkiye . 94 parts In-Stock

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Perfect Parts

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Overview

Upgrade your voltage level translation needs with the MC10H680FN by Onsemi. Known for their high-quality products, Onsemi delivers reliable solutions for a wide range of applications. With its 4 functions and 3-STATE output characteristics, this voltage level translator offers unmatched performance and precision. Say goodbye to compatibility issues and hello to seamless communication with the MC10H680FN. Trust Onsemi for all your voltage level translation requirements and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount capability allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of voltage levels, making this product versatile and adaptable.

No. of Functions: 4

With four functions integrated into one device, this product offers efficiency and convenience by reducing the need for multiple separate components.

Package Shape: SQUARE

The square package shape allows for easier handling and placement on circuit boards, optimizing space utilization and improving overall design aesthetics.

No. of Terminals: 28

The high number of terminals provide ample connection points for interfacing with other components, enabling versatile and complex circuit designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and efficient heat dissipation, making this product suitable for space-constrained environments.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures energy efficiency and compatibility with lower power systems, enhancing the product's versatility.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature allows for reliable performance in diverse environmental conditions, making this product suitable for industrial applications.

Output Characteristics: 3-STATE

The 3-state output characteristics provide flexibility in controlling the output signal, offering enhanced functionality and compatibility with different system requirements.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments, enhancing the product's usability in various applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish offers excellent solderability and corrosion resistance, ensuring long-term reliability and ease of assembly.

Terminal Position: QUAD

The quad terminal position provides stable connection points for interfacing with external components, enhancing the product's reliability and performance.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for compact and space-saving design integration, making this product ideal for applications with limited vertical clearance.

Width: 11.505 mm

The moderate width of the product allows for easy integration into standard circuit board layouts, offering compatibility with common design practices.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures compatibility with various signal types, facilitating seamless integration into diverse circuit configurations.

Peak Reflow Temperature °C: 235

The high peak reflow temperature tolerance ensures robustness during soldering processes, making this product reliable and durable in manufacturing environments.

Length: 11.505 mm

The moderate length of the product provides a balanced form factor for easy integration into standard circuit board layouts, enhancing design flexibility.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade enables reliable performance over a wide temperature range, making this product suitable for commercial and industrial applications.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making this product ideal for applications requiring fast signal processing and energy efficiency.

Terminal Form: J BEND

The J bend terminal form provides secure and stable connections for interfacing with external components, ensuring reliable signal transmission and performance.

Nominal Supply Voltage: 5 V

The 5V nominal supply voltage offers compatibility with standard voltage levels, making this product versatile and widely usable in various electronic systems.

Nominal Negative Supply Voltage: -5.2 V

The nominal negative supply voltage of -5.2V enables bidirectional signal processing and compatibility with systems using dual power supplies, enhancing the product's versatility.

Maximum Delay: 4.8 ns

The low maximum delay ensures fast signal propagation, enabling high-speed data transmission and minimizing signal distortion in time-critical applications.

Terminal Pitch: 1.27 mm

The 1.27mm terminal pitch allows for precise and secure connections, facilitating easy integration into standard circuit board layouts and ensuring reliable signal transmission.

Interface IC Type: TTL TO ECL TRANSCEIVER

The TTL to ECL transceiver interface IC type provides seamless signal conversion between different logic levels, enabling compatibility and communication between diverse electronic systems.

Technical Specifications

Voltage Level Translators MC10H680FN attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.8 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC10H680FN Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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