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MC100ELT25DTR2G

Onsemi

MC100ELT25DTR2G by Onsemi

MC100ELT25DTR2G by Onsemi is a voltage level translator with supply voltage range of +-5V, operating temperature from -40 to 85 °C. It has a max delay of 4.1ns and is ideal for ECL to TTL translation in industrial applications.

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1k+

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Vyrian

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Digiode

USA . 1,719 parts In-Stock

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AZTECH Wire

Italy . 1,218 parts In-Stock

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$11.230

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Microchip USA

USA . 4,683 parts In-Stock

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$12.968

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Component Stockers USA

USA . 709 parts In-Stock

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$99.990

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SupplyDigital Components

Austria . 5,776 parts In-Stock

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Problanco Electronics

Mexico . 4,388 parts In-Stock

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Kulean Microsystems

USA . 2,012 parts In-Stock

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UHIMA Technologies

Türkiye . 549 parts In-Stock

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TANS Electronics

Latvia . 331 parts In-Stock

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Corphita

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Overview

Unleash the power of seamless voltage level translation with the MC100ELT25DTR2G by Onsemi. Designed with precision and reliability in mind, this voltage level translator ensures smooth communication between different voltage domains. Perfect for industrial applications, this small outline, thin profile package offers true output polarity and minimal delay at an affordable price point. Say goodbye to compatibility issues and hello to streamlined operations with the MC100ELT25DTR2G. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection for the internal components of the voltage level translator.

Surface Mount: YES

Allows for easy and secure installation on circuit boards, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

Supports a high voltage input range, making it versatile for a variety of applications.

Package Shape: SQUARE

The square shape allows for efficient use of space on the circuit board.

Power Supplies (V): +-5

Supports both positive and negative power supplies, offering flexibility in system design.

No. of Terminals: 8

Provides multiple connection points for interfacing with other components in the system.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style saves space on the PCB and enables high-density mounting.

Minimum Supply Voltage: 4.5 V

Supports a low minimum supply voltage, ensuring compatibility with a wide range of systems.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures, suitable for industrial applications where heat can be a concern.

Minimum Operating Temperature: -40 °C

Can operate in cold environments, providing versatility in different temperature conditions.

Terminal Finish: TIN

Tin finish on terminals provides good conductivity and corrosion resistance.

Maximum Seated Height: 1.1 mm

Low profile design minimizes the overall height of the component on the PCB.

Width: 3 mm

Narrow width makes it suitable for applications with space constraints.

Output Polarity: TRUE

Output polarity is true, ensuring correct signal transmission in the system.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for up to 30 seconds, enabling reliable soldering processes.

Peak Reflow Temperature °C: 260

Can withstand high peak reflow temperature, ensuring proper soldering and assembly.

Length: 3 mm

Compact length allows for efficient use of space on the PCB.

Temperature Grade: INDUSTRIAL

Suitable for industrial applications with varying temperature conditions and requirements.

Technology: ECL

Utilizes ECL technology, known for its high-speed operation and low power consumption.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures compatibility with standard voltage levels in most systems.

Nominal Negative Supply Voltage: -5 V

Supports a negative supply voltage of -5V, useful for systems requiring both positive and negative voltage supplies.

Maximum Delay: 4.1 ns

Low maximum delay ensures fast signal transmission and minimal signal loss.

Terminal Pitch: 0.65 mm

Small terminal pitch allows for high-density mounting and space-efficient design.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates moderate sensitivity to moisture, suitable for standard storage and handling conditions.

Interface IC Type: ECL TO TTL TRANSLATOR

Specific interface IC type provides accurate translation between ECL and TTL signal levels, ensuring compatibility between different logic families.

Technical Specifications

Voltage Level Translators MC100ELT25DTR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.1 ns

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

+-5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

MC100ELT25DTR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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