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MC100H600FNR2

Onsemi

MC100H600FNR2 by Onsemi

MC100H600FNR2 by Onsemi is a voltage level translator with 9 functions, operating at 4.5-5.5V. It has a max delay of 3.2ns and operates in commercial extended temperature grade range (0-75 °C). Ideal for TTL to ECL translation applications due to its ECL100K technology and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Vyrian

USA . 2,305 parts In-Stock

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Digiode

USA . 635 parts In-Stock

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635

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LIBRA Elektronik GmbH

Germany . 470 parts In-Stock

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470

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Legend Electronics Inc.

USA . 374 parts In-Stock

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ECAB

Sweden . 349 parts In-Stock

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349

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Problanco Electronics

Mexico . 6,773 parts In-Stock

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Kulean Microsystems

USA . 4,889 parts In-Stock

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TANS Electronics

Latvia . 4,848 parts In-Stock

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Kepictronics

USA . 4,000 parts In-Stock

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SupplyDigital Components

Austria . 3,040 parts In-Stock

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Corphita

USA . 485 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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Microchip USA

USA . 432 parts In-Stock

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UHIMA Technologies

Türkiye . 122 parts In-Stock

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Overview

Upgrade your voltage level translation with the MC100H600FNR2 by Onsemi. This reliable and versatile chip carrier offers 9 functions in a compact square package, perfect for surface mount applications. With a maximum supply voltage of 5.5V and a minimum operating temperature of 0 °C, this translator is designed to perform under tough conditions. Whether you're working on industrial automation or telecommunications projects, this commercial-grade ECL100K technology will deliver superior performance and accuracy. Trust Onsemi's reputation for quality and innovation, and elevate your designs with the MC100H600FNR2 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Being surface mountable enables easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for compatibility with a wide range of systems and devices.

No. of Functions: 9

With 9 functions, this voltage level translator offers versatility and can handle complex signal translations effectively.

Package Shape: SQUARE

The square package shape provides a compact footprint, making it easier to integrate into circuit designs.

Power Supplies (V): 5,-4.5

Supporting multiple power supply voltages gives flexibility in connecting to different components and systems.

No. of Terminals: 28

Having 28 terminals allows for connecting to various input and output signals, increasing the product's versatility.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers good thermal conductivity and efficient heat dissipation for reliable performance.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of systems while providing efficient power consumption.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature range ensures reliable performance even in harsh environmental conditions.

Output Characteristics: OPEN-EMITTER

The open-emitter output characteristics allow for easy interfacing with different types of devices and circuits.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the product can function effectively in varying temperature conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring a reliable connection between the terminal and the PCB.

Terminal Position: QUAD

The quad terminal position facilitates easy and secure mounting on the PCB, enhancing the product's overall stability.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a slim profile, making the product suitable for compact devices and tight spaces.

Width: 11.505 mm

The specific width dimension helps in determining the product's footprint and compatibility with standard PCB layouts.

Output Polarity: TRUE

Having true output polarity ensures accurate signal translation and compatibility between different logic levels.

Peak Reflow Temperature °C: 235

The high peak reflow temperature enables efficient soldering during assembly, ensuring a strong and reliable connection.

Length: 11.505 mm

The specific length dimension helps in determining the product's footprint and compatibility with standard PCB layouts.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade ensures the product can operate reliably in a wide range of temperature conditions, suitable for commercial applications.

Technology: ECL100K

The ECL100K technology used in the product offers high-speed signal processing, making it ideal for applications requiring fast data transmission.

Terminal Form: J BEND

The J bend terminal form facilitates easy and secure mounting on the PCB, ensuring reliable connections and stable performance.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and systems, making integration easier.

Maximum Delay: 3.2 ns

The low maximum delay ensures fast signal processing and minimal latency, critical for applications requiring real-time data transmission.

Terminal Pitch: 1.27 mm

The specific terminal pitch helps determine the product's compatibility with standard PCB layouts and ease of assembly.

Interface IC Type: TTL TO ECL TRANSLATOR

The TTL to ECL translator interface IC type ensures seamless communication and signal translation between TTL and ECL logic levels.

Technical Specifications

Voltage Level Translators MC100H600FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.2 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

9

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

235

Power Supplies (V):

5,-4.5

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL100K

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H600FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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