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MC10H124ML2

Onsemi

MC10H124ML2 by Onsemi

MC10H124ML2 by Onsemi is a voltage level translator with 4 functions, operating b/w 0-75 °C. It features TTL to ECL translation, with max delay of 2.95 ns and supply voltage range of 4.75-5.25 V. Ideal for commercial extended temperature grade applications requiring complementary output polarity.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,093 parts In-Stock

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Digiode

USA . 740 parts In-Stock

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740

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Kulean Microsystems

USA . 5,804 parts In-Stock

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5,804

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SupplyDigital Components

Austria . 5,261 parts In-Stock

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TANS Electronics

Latvia . 4,182 parts In-Stock

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Corphita

USA . 1,469 parts In-Stock

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Problanco Electronics

Mexico . 678 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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UHIMA Technologies

Türkiye . 96 parts In-Stock

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Overview

Upgrade your electronic systems with the MC10H124ML2 voltage level translator by Onsemi. Designed with precision and reliability in mind, this product offers seamless integration, high performance, and compatibility across a wide range of applications. With its innovative technology and superior quality, Onsemi ensures that you get the best value for your investment. Experience enhanced efficiency and functionality with the MC10H124ML2 - the perfect solution for all your voltage translation needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving space and reducing manufacturing costs.

Maximum Supply Voltage: 5.25 V

With a high maximum supply voltage, this product can handle a wide range of input voltages, making it versatile and adaptable for various applications.

No. of Functions: 4

Having multiple functions in one device reduces the need for additional components, simplifying the design and saving space on the PCB.

Package Shape: RECTANGULAR

Rectangular shape is common and standard, making it easy to integrate the product into existing PCB layouts and designs.

No. of Terminals: 16

Having a high number of terminals allows for more connections and interfaces, increasing the flexibility and functionality of the product.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact and efficient board layouts.

Minimum Supply Voltage: 4.75 V

With a low minimum supply voltage, the product can operate efficiently even at lower power levels, saving energy and reducing heat dissipation.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures reliability and durability in various environmental conditions, especially in industrial settings.

Output Characteristics: OPEN-EMITTER

Open-emitter output allows for easy interfacing with other components and devices, enhancing the versatility and compatibility of the product.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments, making the product suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

High-quality terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: DUAL

Dual terminal position allows for flexibility in mounting and installation, making it easy to integrate the product into different systems and configurations.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies interfacing with other components and devices, reducing the risk of errors and compatibility issues.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable operation over a wide temperature range, making the product suitable for harsh environments and demanding applications.

Technology: ECL

ECL technology offers high-speed performance and low power consumption, making the product ideal for applications requiring fast data transmission and high efficiency.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable connections, preventing damage and ensuring consistent performance over time.

Nominal Supply Voltage: 5 V

With a standard nominal supply voltage, the product is compatible with a wide range of systems and devices, making it a versatile and reliable choice.

Nominal Negative Supply Voltage: -5.2 V

Having a nominal negative supply voltage allows for dual power supply operation, providing flexibility and compatibility with different system configurations.

Maximum Delay: 2.95 ns

Low maximum delay ensures fast signal processing and minimal latency, making the product suitable for high-speed applications and systems.

Interface IC Type: TTL TO ECL TRANSLATOR

Being a TTL to ECL translator interface IC type, this product facilitates seamless communication between devices operating on different logic levels, enhancing interoperability and compatibility.

Technical Specifications

Voltage Level Translators MC10H124ML2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2.95 ns

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

MC10H124ML2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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