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MC100H680FNR2

Onsemi

MC100H680FNR2 by Onsemi

MC100H680FNR2 by Onsemi is a voltage level translator with 4 functions, operating at 0-75 °C. It has TTL to ECL transceiver interface, 4.8 ns max delay, and supports supply voltages from 4.5V to 5.5V. Ideal for applications requiring high-speed signal translation in commercial extended temperature environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,699 parts In-Stock

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Vyrian

USA . 582 parts In-Stock

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SupplyDigital Components

Austria . 8,335 parts In-Stock

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TANS Electronics

Latvia . 8,288 parts In-Stock

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Corphita

USA . 2,023 parts In-Stock

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UHIMA Technologies

Türkiye . 687 parts In-Stock

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Kulean Microsystems

USA . 672 parts In-Stock

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Problanco Electronics

Mexico . 436 parts In-Stock

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Corohmni

South Africa . 398 parts In-Stock

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Overview

Upgrade your electronic devices with the powerful MC100H680FNR2 from Onsemi, a leading manufacturer in the industry. This voltage level translator boasts top-notch quality and reliability, making it perfect for a wide range of applications. With a package body material of PLASTIC/EPOXY and 3-STATE output characteristics, this chip carrier ensures seamless communication between different voltage levels. Experience the value and benefits of this innovative product, offering customers unmatched performance and efficiency. Elevate your projects with the MC100H680FNR2 and see the difference for yourself!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and long-lasting applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards, simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can be used in a wide range of voltage applications, providing flexibility and versatility.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, saving space and cost in the circuit design.

Package Shape: SQUARE

The square package shape is commonly used for compact designs, allowing for efficient use of space on the circuit board.

No. of Terminals: 28

The high number of terminals provides ample connectivity options, making it suitable for complex circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier style offers a secure and reliable packaging option, protecting the internal components from damage and ensuring longevity.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of power sources, enhancing the product's usability.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this product can withstand elevated temperatures, making it suitable for a variety of environments and applications.

Output Characteristics: 3-STATE

The 3-state output characteristics allow for high impedance state, enabling efficient interfacing with other devices and minimizing power consumption.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions, making it suitable for diverse operating environments.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, reducing the risk of signal loss or interference in the circuit.

Maximum Seated Height: 4.57 mm

The low maximum seated height allows for a slim and compact profile, facilitating space-saving designs in compact electronic devices.

Width: 11.505 mm

The specific width measurement helps in precise placement on the circuit board, ensuring proper alignment and functionality.

Output Polarity: COMPLEMENTARY

The complementary output polarity simplifies signal processing and enhances compatibility with other components in the circuit.

Length: 11.505 mm

The specific length measurement ensures uniform sizing and compatibility with standard mounting configurations, facilitating ease of installation.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade allows for reliable operation in a wide range of temperature conditions, ensuring consistent performance.

Technology: ECL

The ECL technology offers high-speed operation and low power consumption, making it suitable for applications requiring efficient signal processing.

Terminal Form: J BEND

The J bend terminal form provides a secure and stable connection, minimizing the risk of signal loss or interruption in the circuit.

Nominal Supply Voltage: 5 V

The nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Maximum Delay: 4.8 ns

The low maximum delay time facilitates fast signal transmission and reduces latency, enhancing the overall performance of the product.

Terminal Pitch: 1.27 mm

The specific terminal pitch measurement allows for easy connection to standard circuit boards, ensuring compatibility and ease of installation.

Interface IC Type: TTL TO ECL TRANSCEIVER

The TTL to ECL transceiver interface allows for seamless communication between devices utilizing different signal formats, enhancing interoperability.

Technical Specifications

Voltage Level Translators MC100H680FNR2 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

4.8 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J28

Length:

11.505 mm

No. of Bits:

1

No. of Functions:

4

No. of Terminals:

28

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.505 mm

Trade Compliance

MC100H680FNR2 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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