Loading...

NVT2010BS,118

NXP Semiconductors

NVT2010BS,118 by NXP Semiconductors

GTL TO TTL TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 24; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$0.708

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 373 parts In-Stock

1+ parts

-

100+ parts

$0.708

1k+ parts

$0.588

10k+ parts

$0.524

373

-

$0.708

$0.588

$0.524

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,875 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

10k+ parts

-

4,875

$0.552

-

-

-

Vyrian

USA . 6,372 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,372

-

-

-

-

Anansix

USA . 434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

434

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,427 parts In-Stock

1+ parts

$0.523

100+ parts

-

1k+ parts

-

10k+ parts

-

4,427

$0.523

-

-

-

Component Stockers USA

USA . 451 parts In-Stock

1+ parts

$0.600

100+ parts

$0.560

1k+ parts

-

10k+ parts

-

451

$0.600

$0.560

-

-

AZTECH Wire

Italy . 584 parts In-Stock

1+ parts

$15.850

100+ parts

-

1k+ parts

-

10k+ parts

-

584

$15.850

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 5,684 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,684

-

-

-

-

UNI Independent Distributors

Spain . 5,573 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,573

-

-

-

-

Microchip USA

USA . 4,152 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,152

-

-

-

-

Technical Specifications

Voltage Level Translators NVT2010BS,118 attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Maximum Delay:

.375 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

S-PQCC-N24

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

10

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

NONE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC24,.16SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NVT2010BS,118 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20