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NVT2008BQ

NXP Semiconductors

NVT2008BQ by NXP Semiconductors

NXP Semiconductors' NVT2008BQ is an 8-bit voltage level translator with a max supply voltage of 5.5V, suitable for industrial applications. It features open-drain output characteristics and operates b/w -40 to 85°C temperatures. The chip carrier package style with a very thin profile makes it ideal for space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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Chip Stock

USA . 7,500 parts In-Stock

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Flip Electronics

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Digiode

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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Anansix

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Vyrian

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Nova Conductors

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Distributors (Availability)

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Ampacity Inc.

Singapore . 520 parts In-Stock

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$1.500

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AZTECH Wire

Italy . 881 parts In-Stock

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One Stop Electronics

USA . 199 parts In-Stock

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Aranea Global

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Overview

Elevate your electronics projects with the NVT2008BQ from NXP Semiconductors, a top-tier manufacturer known for quality. This voltage level translator is a game-changer, offering seamless communication between different voltage systems. With its impressive range of applications and reliable performance, this product is a must-have for tech enthusiasts looking to take their creations to the next level. Upgrade your projects today with the NVT2008BQ and experience the difference in quality and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and reliable, ensuring the product's longevity and stability in various environments.

Maximum Supply Voltage: 5.4 V

With a high maximum supply voltage, this product can handle a wide range of power inputs without easily getting damaged.

No. of Bits: 8

Having 8 bits allows for greater precision and accuracy in voltage level translation, making it suitable for complex electronic systems.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures that the product can function reliably even in hot environments without overheating.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristic provides flexibility in connecting to different types of devices, making it versatile in application.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures that the product can still perform effectively in cold conditions without freezing or malfunctioning.

Technical Specifications

Voltage Level Translators NVT2008BQ attributes and parameters. Explore more Voltage Level Translators devices from NXP Semiconductors

Specs

Additional Features:

TOTEM OUTPUT CHARACTERISTIC ALSO POSSIBLE

Maximum Delay:

.375 ns

Input Characteristics:

STANDARD

Interface IC Type:

JESD-30 Code:

R-PQCC-N20

JESD-609 Code:

e4

Length:

4.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Latch/Register:

NONE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC20,.1X.18,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

5.4 V

Minimum Supply Voltage:

0 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

2.5 mm

Trade Compliance

NVT2008BQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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