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NB4N121KMNR2G

Onsemi

NB4N121KMNR2G by Onsemi

NB4N121KMNR2G by Onsemi is a voltage level translator with a max supply voltage of 3.6V and min of 3V, operating b/w -40 to 70°C. It features a PECL to CML interface IC type, output polarity is complementary, and has a max delay of 0.95ns. Ideal for applications requiring precise signal translation in compact spaces due to its small square package shape and surface mount capability.

Median Price

$7.700

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,682 parts In-Stock

1+ parts

$9.150

100+ parts

$6.053

1k+ parts

$5.494

10k+ parts

$5.385

1,682

$9.150

$6.053

$5.494

$5.385

Mouser Electronics

USA . 826 parts In-Stock

1+ parts

$9.150

100+ parts

$6.060

1k+ parts

$5.250

10k+ parts

$5.240

826

$9.150

$6.060

$5.250

$5.240

Rochester

USA . 12,176 parts In-Stock

1+ parts

-

100+ parts

$5.000

1k+ parts

$4.470

10k+ parts

$4.210

12,176

-

$5.000

$4.470

$4.210

Verical

USA . 7,950 parts In-Stock

1+ parts

-

100+ parts

$6.250

1k+ parts

$5.588

10k+ parts

$5.263

7,950

-

$6.250

$5.588

$5.263

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,083 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

-

10k+ parts

-

2,083

$5.282

-

-

-

Vyrian

USA . 2,405 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,405

$5.560

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 442 parts In-Stock

1+ parts

$5.004

100+ parts

-

1k+ parts

-

10k+ parts

-

442

$5.004

-

-

-

Corohmni

South Africa . 103 parts In-Stock

1+ parts

$5.560

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$5.560

-

-

-

Component Stockers USA

USA . 16,901 parts In-Stock

1+ parts

$5.640

100+ parts

$5.300

1k+ parts

$4.800

10k+ parts

$4.800

16,901

$5.640

$5.300

$4.800

$4.800

QUARKTWIN TECHNOLOGY LTD

USA . 19,271 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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19,271

-

-

-

-

Problanco Electronics

Mexico . 6,257 parts In-Stock

1+ parts

-

100+ parts

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6,257

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,254 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,254

-

-

-

-

TANS Electronics

Latvia . 4,788 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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4,788

-

-

-

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Kulean Microsystems

USA . 4,651 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,651

-

-

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

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2,000

-

-

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Metaverse IC Inc.

Canada . 1,524 parts In-Stock

1+ parts

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100+ parts

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1,524

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-

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Kepictronics

USA . 1,514 parts In-Stock

1+ parts

-

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1,514

-

-

-

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SupplyDigital Components

Austria . 249 parts In-Stock

1+ parts

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100+ parts

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249

-

-

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UHIMA Technologies

Türkiye . 141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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141

-

-

-

-

Overview

Elevate your voltage level translation capabilities with the NB4N121KMNR2G by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. This voltage level translator is perfect for a wide range of applications, ensuring seamless communication between different voltage domains. With a compact square package design and various advanced features, the NB4N121KMNR2G offers unparalleled value and benefits to customers seeking high-performance solutions. Upgrade your systems today and experience the advantages that this exceptional product brings to the table.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging allows for easy integration onto circuit boards, saving space and simplifying assembly processes.

Maximum Supply Voltage: 3.6 V

Accepts a wide range of supply voltages, making it versatile for various applications.

Package Shape: SQUARE

Square package shape provides a compact form factor, ideal for space-constrained designs.

No. of Terminals: 52

A high number of terminals allow for connectivity to multiple components, enhancing functionality and flexibility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile provides efficient heat dissipation and compact design, improving overall performance.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a wide range of systems and power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance under various environmental conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures stable operation even in extreme cold conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides corrosion resistance and excellent solderability, ensuring a secure connection.

Terminal Position: QUAD

Quad terminal position enables easy and reliable connection to other components, improving overall system stability.

Maximum Seated Height: 1 mm

Low maximum seated height allows for a slim profile and compatibility with compact designs.

Width: 8 mm

Narrow width facilitates easy placement on circuit boards, optimizing space usage.

Output Polarity: COMPLEMENTARY

Complementary output polarity ensures efficient signal processing and compatibility with a wide range of systems.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature promotes quick and reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures stable solder connections for robust performance.

Length: 8 mm

Compact length contributes to a space-saving design and easy integration in tight spaces.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability by eliminating potential solder joint failures common with leaded components.

Nominal Supply Voltage: 3.3 V

Close match to the standard 3.3V supply voltage simplifies integration into existing systems and power supplies.

Maximum Delay: 0.95 ns

Low maximum delay ensures fast signal processing, making it suitable for high-speed applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch offers precise connectivity and enables high-density component placement on circuit boards.

Interface IC Type: PECL TO CML TRANSLATOR

Specific interface IC type ensures seamless communication between different signal levels, enhancing system compatibility and performance.

Technical Specifications

Voltage Level Translators NB4N121KMNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.95 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N52

JESD-609 Code:

e3

Length:

8 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

52

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

NB4N121KMNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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