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NB4N111KMNR4G

Onsemi

NB4N111KMNR4G by Onsemi

NB4N111KMNR4G by Onsemi is a voltage level translator with a max supply voltage of 3.6V and min supply voltage of 3V. It operates in temperatures ranging from -40 °C to 70°C, making it suitable for applications requiring PECL to CML translation in compact spaces. With a terminal pitch of 0.5mm and output polarity as complementary, this chip carrier package offers fast signal processing with a max delay of 1.1ns.

Median Price

$13.084

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,000 parts In-Stock

1+ parts

$15.230

100+ parts

$10.377

1k+ parts

$9.503

10k+ parts

-

1,000

$15.230

$10.377

$9.503

-

Chip1Stop

Japan . 620 parts In-Stock

1+ parts

$46.200

100+ parts

$21.900

1k+ parts

$16.700

10k+ parts

-

620

$46.200

$21.900

$16.700

-

Rochester

USA . 3,545 parts In-Stock

1+ parts

-

100+ parts

$8.750

1k+ parts

$7.830

10k+ parts

$7.370

3,545

-

$8.750

$7.830

$7.370

Verical

USA . 3,100 parts In-Stock

1+ parts

-

100+ parts

$10.938

1k+ parts

$9.787

10k+ parts

$9.213

3,100

-

$10.938

$9.787

$9.213

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,953 parts In-Stock

1+ parts

$9.244

100+ parts

-

1k+ parts

-

10k+ parts

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1,953

$9.244

-

-

-

Vyrian

USA . 2,261 parts In-Stock

1+ parts

-

100+ parts

-

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-

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2,261

-

-

-

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Flip Electronics

USA . 1,000 parts In-Stock

1+ parts

-

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-

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1,000

-

-

-

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Elcom Components

USA . 2 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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2

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,939 parts In-Stock

1+ parts

$8.757

100+ parts

-

1k+ parts

-

10k+ parts

-

1,939

$8.757

-

-

-

Corohmni

South Africa . 92 parts In-Stock

1+ parts

$9.730

100+ parts

-

1k+ parts

-

10k+ parts

-

92

$9.730

-

-

-

Component Stockers USA

USA . 5,486 parts In-Stock

1+ parts

$10.060

100+ parts

$9.460

1k+ parts

$8.550

10k+ parts

-

5,486

$10.060

$9.460

$8.550

-

Microchip USA

USA . 3,724 parts In-Stock

1+ parts

$27.643

100+ parts

-

1k+ parts

-

10k+ parts

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3,724

$27.643

-

-

-

TANS Electronics

Latvia . 7,774 parts In-Stock

1+ parts

-

100+ parts

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7,774

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-

-

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SupplyDigital Components

Austria . 6,369 parts In-Stock

1+ parts

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6,369

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-

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Perfect Parts

USA . 4,458 parts In-Stock

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4,458

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Kulean Microsystems

USA . 4,203 parts In-Stock

1+ parts

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4,203

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UHIMA Technologies

Türkiye . 651 parts In-Stock

1+ parts

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651

-

-

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GreenTree Electronics

Israel . 620 parts In-Stock

1+ parts

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100+ parts

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620

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Authorized Procurement Solutions

USA . 620 parts In-Stock

1+ parts

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620

-

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Problanco Electronics

Mexico . 480 parts In-Stock

1+ parts

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480

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Kepictronics

USA . 150 parts In-Stock

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150

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Overview

Upgrade your voltage level translation needs with the NB4N111KMNR4G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This surface-mount device boasts seamless integration into various applications, offering customers unmatched value and performance. Say goodbye to compatibility issues and hello to smoother operations with this innovative solution. Experience the benefits of precision engineering and cutting-edge technology with the NB4N111KMNR4G.

Feature Benefit Bullets

Surface Mount: YES

Provides easy and convenient installation on a circuit board, saving time and effort.

Maximum Supply Voltage: 3.6 V

Supports a wide range of input voltages, making it versatile for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the PCB, enabling compact designs.

No. of Terminals: 32

Provides ample connectivity options for interfacing with other components in the system.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers enhanced thermal dissipation with the heat sink/slug design and allows for a low-profile installation.

Minimum Supply Voltage: 3 V

Operates efficiently with a low minimum supply voltage, reducing power consumption.

Maximum Operating Temperature: 70 °C

Maintains performance and reliability in high-temperature environments, ensuring consistent operation.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, expanding its usability in various settings.

Terminal Finish: MATTE TIN

Provides a durable and corrosion-resistant finish, ensuring long-term reliability and performance.

Terminal Position: QUAD

Quad terminal position allows for easy and secure connections, minimizing installation errors.

Maximum Seated Height: 1 mm

Low seated height enables a compact layout on the PCB, contributing to space-saving designs.

Width: 5 mm

Compact width dimension facilitates integration into tight spaces, enhancing overall design flexibility.

Output Polarity: COMPLEMENTARY

Complementary output polarity simplifies signal processing and compatibility with other components in the system.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient reflow soldering during manufacturing processes, saving time and resources.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures, ensuring robustness and reliability in assembly processes.

Length: 5 mm

Compact length dimension contributes to a space-efficient design, ideal for compact electronic devices.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and supports eco-friendly manufacturing practices.

Nominal Supply Voltage: 3.3 V

Operates at a stable and standard supply voltage, ensuring compatibility with commonly used power sources.

Maximum Delay: 1.1 ns

Provides minimal delay in signal translation, maintaining high-speed and accurate data transmission.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for precise connections and compact PCB layout, enhancing overall design flexibility.

Interface IC Type: PECL TO CML TRANSLATOR

Specific IC type tailored for translating between PECL and CML signals, ensuring seamless communication between different signal standards.

Technical Specifications

Voltage Level Translators NB4N111KMNR4G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

1.1 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N32

JESD-609 Code:

e3

Length:

5 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

NB4N111KMNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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