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MC10ELT24MNR4G

Onsemi

MC10ELT24MNR4G by Onsemi

MC10ELT24MNR4G by Onsemi is a voltage level translator with 8 terminals, operating b/w -40 to 85 °C. It features TTL to ECL translation, with a max delay of 2 ns. Ideal for industrial applications requiring precise signal conversion in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,976 parts In-Stock

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Digiode

USA . 701 parts In-Stock

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701

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SupplyDigital Components

Austria . 5,945 parts In-Stock

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Problanco Electronics

Mexico . 4,440 parts In-Stock

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Kulean Microsystems

USA . 1,510 parts In-Stock

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UHIMA Technologies

Türkiye . 574 parts In-Stock

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TANS Electronics

Latvia . 539 parts In-Stock

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Corohmni

South Africa . 454 parts In-Stock

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Corphita

USA . 371 parts In-Stock

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Overview

Unlock new possibilities with the MC10ELT24MNR4G by Onsemi! This voltage level translator offers top-notch quality and reliability, backed by Onsemi's stellar reputation in the industry. Ideal for a wide range of applications, this product provides seamless voltage translation with ease. Say goodbye to compatibility issues and hello to smooth operations with the MC10ELT24MNR4G. Experience the value and benefits it brings to your projects today!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology makes this product easy to integrate onto circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this voltage level translator can handle a wide range of input signals, providing flexibility in various applications.

Package Shape: SQUARE

The square package shape allows for easy placement and alignment on the PCB, enhancing the overall design aesthetics.

Power Supplies (V): 5,-4.5/-5.2

This product supports multiple power supply voltages, enabling compatibility with different systems and simplifying integration.

No. of Terminals: 8

Having 8 terminals allows for more connections and versatility in the application of this voltage level translator.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile of the package style make this product suitable for compact designs with efficient heat dissipation.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures compatibility with a wide range of systems and input signals, making this voltage level translator versatile.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions, ensuring reliable performance in industrial settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this voltage level translator suitable for use in extreme cold environments without compromising functionality.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides a durable and reliable connection, enhancing the overall performance and lifespan of the product.

Terminal Position: DUAL

The dual terminal position offers flexibility in placement and connection options, making this voltage level translator adaptable to various circuit layouts.

Maximum Seated Height: 1 mm

With a low maximum seated height, this product is suitable for slim and compact designs, optimizing space utilization on the PCB.

Width: 2 mm

The compact width of 2 mm ensures that this voltage level translator can be easily integrated into tight spaces without sacrificing performance or functionality.

Output Polarity: COMPLEMENTARY

The complementary output polarity ensures accurate signal conversion and transmission, making this voltage level translator reliable in data communication applications.

Length: 2 mm

The short length of 2 mm allows for efficient placement and routing on the PCB, contributing to a neat and organized circuit design.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this voltage level translator can withstand harsh operating conditions and deliver consistent performance in demanding environments.

Technology: ECL

Employing ECL technology ensures fast signal processing and high-speed operation, making this product suitable for applications that require rapid data transmission.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the need for traditional soldering, simplifying the assembly process and reducing the risk of connection issues.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V provides a stable power source for this voltage level translator, ensuring consistent and reliable signal conversion.

Nominal Negative Supply Voltage: -5 V

Supporting a nominal negative supply voltage of -5 V enables bidirectional signal translation, enhancing the versatility and compatibility of this product in mixed signal environments.

Maximum Delay: 2 ns

With a maximum delay of 2 ns, this voltage level translator offers quick signal conversion and transmission, ensuring minimal latency and high-speed performance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for dense packing and precise connections, making this product ideal for high-density circuit layouts and miniaturized designs.

Interface IC Type: TTL TO ECL TRANSLATOR

The interface IC type of TTL to ECL translator enables seamless communication and signal conversion between different logic levels, making this product essential for interfacing between TTL and ECL systems.

Technical Specifications

Voltage Level Translators MC10ELT24MNR4G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

2 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e3

Length:

2 mm

Nominal Negative Supply Voltage:

-5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Power Supplies (V):

5,-4.5/-5.2

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC10ELT24MNR4G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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