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SN10KHT5565NT

Texas Instruments

SN10KHT5565NT by Texas Instruments

SN10KHT5565NT by Texas Instruments is an 8-function voltage level translator with a package style of IN-LINE. It operates b/w 0-75°C, has TRUE output polarity, and offers a max delay of 0 ns. Ideal for TTL to ECL transceiver applications due to its ECL technology and DUAL terminal position.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,461 parts In-Stock

1+ parts

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7,461

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Digiode

USA . 1,130 parts In-Stock

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1,130

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 2,202 parts In-Stock

1+ parts

$2.644

100+ parts

-

1k+ parts

$3.134

10k+ parts

-

2,202

$2.644

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$3.134

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DigiPath Technology Company

USA . 2,207 parts In-Stock

1+ parts

$2.912

100+ parts

-

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2,207

$2.912

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ChromeModa Solutions

Germany . 5,890 parts In-Stock

1+ parts

$2.971

100+ parts

$2.436

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-

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5,890

$2.971

$2.436

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IDEA Electronic Components Group

UK . 1,114 parts In-Stock

1+ parts

$2.971

100+ parts

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1k+ parts

$2.674

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1,114

$2.971

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$2.674

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AZTECH Wire

Italy . 628 parts In-Stock

1+ parts

$14.351

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628

$14.351

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One Stop Electronics

USA . 904 parts In-Stock

1+ parts

$37.500

100+ parts

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904

$37.500

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Corphita

USA . 2,322 parts In-Stock

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2,322

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Overview

Unlock new levels of performance and reliability with the SN10KHT5565NT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and cutting-edge technology in their voltage level translators. With 8 functions packed into a compact rectangular package, this versatile device offers seamless integration and enhanced efficiency for a wide range of applications. Elevate your projects with the SN10KHT5565NT and experience unparalleled value, benefits, and advantages that only Texas Instruments can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic and epoxy material provides good durability and resistance to heat, making this product suitable for a variety of environments.

No. of Functions: 8

Having multiple functions allows for versatile usage and the ability to handle different types of voltage level translations.

Package Shape: RECTANGULAR

Rectangular shape aids in easy installation and PCB layout, making it convenient for integration into circuits.

No. of Terminals: 24

Having a higher number of terminals allows for more connections and flexibility in the application of voltage translations.

Maximum Operating Temperature: 75 °C

High maximum operating temperature ensures stable performance even in demanding conditions.

Output Characteristics: 3-STATE

3-state output enables the device to have three output states: high, low, and high impedance, providing flexibility in signal routing.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can be used in a wide range of temperature environments without compromising performance.

Terminal Position: DUAL

Dual terminal position allows for easier connectivity and PCB routing, enhancing the overall efficiency of the product.

Maximum Seated Height: 5.08 mm

Compact size with a low seated height makes it suitable for applications where space is limited.

Width: 7.62 mm

Narrow width allows for easy integration into densely packed circuits and PCB layouts.

Output Polarity: TRUE

True output polarity ensures accurate voltage level translation, reducing the risk of signal errors in the circuit.

Length: 31.64 mm

Optimal length for accommodating multiple functions and terminals while maintaining a compact design.

Temperature Grade: COMMERCIAL EXTENDED

Commercial extended temperature grade ensures reliable performance in both standard and extended temperature ranges.

Technology: ECL

ECL technology provides fast switching speeds and low power consumption, making it ideal for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form simplifies soldering and PCB assembly, ensuring secure connections during operation.

Maximum Delay: 0 ns

Zero delay ensures minimal latency in signal translation, maintaining signal integrity and precision in the output.

Terminal Pitch: 2.54 mm

Standard terminal pitch allows for compatibility with commonly used PCB layouts and components, making it easy to integrate into existing designs.

Interface IC Type: TTL TO ECL TRANSCEIVER

TTL to ECL transceiver interface IC type enables seamless communication between different logic levels, making it versatile for a wide range of applications.

Technical Specifications

Voltage Level Translators SN10KHT5565NT attributes and parameters. Explore more Voltage Level Translators devices from Texas Instruments

Specs

Maximum Delay:

0 ns

Interface IC Type:

JESD-30 Code:

R-PDIP-T24

Length:

31.64 mm

No. of Bits:

1

No. of Functions:

8

No. of Terminals:

24

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Latch/Register:

NONE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Surface Mount:

NO

Technology:

ECL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

SN10KHT5565NT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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