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MC10H124FNR2G

Onsemi

MC10H124FNR2G by Onsemi

MC10H124FNR2G by Onsemi is a voltage level translator with 4 functions, operating at 5.25V max supply and -5.2V min supply. It has a delay of 3.1ns, suitable for TTL to ECL translation in commercial extended temperature applications. The chip carrier package is surface mountable and features open-emitter output characteristics.

Median Price

$5.640

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 966 parts In-Stock

1+ parts

$8.000

100+ parts

$5.248

1k+ parts

$4.751

10k+ parts

$4.692

966

$8.000

$5.248

$4.751

$4.692

Chip1Stop

Japan . 188 parts In-Stock

1+ parts

$27.000

100+ parts

$11.200

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188

$27.000

$11.200

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Flip Electronics (Authorized)

USA . 8,500 parts In-Stock

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8,500

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Rochester

USA . 3,031 parts In-Stock

1+ parts

-

100+ parts

$4.310

1k+ parts

$3.860

10k+ parts

$3.630

3,031

-

$4.310

$3.860

$3.630

Farnell

UK . 3,031 parts In-Stock

1+ parts

-

100+ parts

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$5.642

10k+ parts

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3,031

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$5.642

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Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.638

1k+ parts

$5.050

10k+ parts

$4.750

500

-

$5.638

$5.050

$4.750

Mouser Electronics

USA . 39 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.520

10k+ parts

$4.380

39

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-

$4.520

$4.380

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,364 parts In-Stock

1+ parts

$4.520

100+ parts

-

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1,364

$4.520

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Digiode

USA . 267 parts In-Stock

1+ parts

$4.778

100+ parts

-

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267

$4.778

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Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

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8,000

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J & M Industries LLC

USA . 339 parts In-Stock

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339

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Bristol Electronics

USA . 189 parts In-Stock

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189

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Inventory MP

USA . 23 parts In-Stock

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23

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Distributors (Availability)

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Corohmni

South Africa . 245 parts In-Stock

1+ parts

$4.520

100+ parts

-

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245

$4.520

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Corphita

USA . 1,946 parts In-Stock

1+ parts

$4.527

100+ parts

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1,946

$4.527

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Component Stockers USA

USA . 5,034 parts In-Stock

1+ parts

$5.110

100+ parts

$4.800

1k+ parts

$4.340

10k+ parts

-

5,034

$5.110

$4.800

$4.340

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Microchip USA

USA . 23 parts In-Stock

1+ parts

$14.140

100+ parts

$13.940

1k+ parts

$13.830

10k+ parts

$13.730

23

$14.140

$13.940

$13.830

$13.730

Lixinc

USA . 13,460 parts In-Stock

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13,460

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QUARKTWIN TECHNOLOGY LTD

USA . 9,812 parts In-Stock

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9,812

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SupplyDigital Components

Austria . 6,597 parts In-Stock

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6,597

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TANS Electronics

Latvia . 6,395 parts In-Stock

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6,395

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Kulean Microsystems

USA . 5,443 parts In-Stock

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Problanco Electronics

Mexico . 3,964 parts In-Stock

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3,964

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Continental Prestige Electronics

USA . 2,581 parts In-Stock

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$4.420

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$4.420

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Perfect Parts

USA . 2,482 parts In-Stock

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UHIMA Technologies

Türkiye . 317 parts In-Stock

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Metaverse IC Inc.

Canada . 261 parts In-Stock

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Authorized Procurement Solutions

USA . 188 parts In-Stock

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188

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GreenTree Electronics

Israel . 188 parts In-Stock

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Kepictronics

USA . 37 parts In-Stock

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Overview

Enhance your electronic designs with the MC10H124FNR2G by Onsemi, a top-quality voltage level translator that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted industry leader, this chip carrier package is ideal for various applications in electronics. With its advanced technology and precise output characteristics, this versatile product ensures seamless signal translation with minimal delay. Experience the value and benefits of using the MC10H124FNR2G in your projects, and elevate your designs to new heights of efficiency and functionality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Maximum Supply Voltage: 5.25 V

Allows the voltage translator to handle a wide range of input voltages, making it versatile for different applications.

No. of Functions: 4

Having multiple functions in a single device reduces the need for additional components, saving space and simplifying the design.

Minimum Operating Temperature: 0 °C

Can operate in low temperature environments without any issues, making it suitable for a variety of conditions.

Output Polarity: COMPLEMENTARY

The complementary output allows for easy integration with other systems and ensures accurate signal translation.

Technical Specifications

Voltage Level Translators MC10H124FNR2G attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

3.1 ns

Interface IC Type:

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e3

Length:

8.965 mm

Moisture Sensitivity Level (MSL):

3

Nominal Negative Supply Voltage:

-5.2 V

No. of Bits:

2

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

OPEN-EMITTER

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC20,.4SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

5,-5.2

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8.965 mm

Trade Compliance

MC10H124FNR2G Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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