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MC10EPT20MNR4

Onsemi

MC10EPT20MNR4 by Onsemi

MC10EPT20MNR4 by Onsemi is a voltage level translator with 3.3V power supply, 0.45ns max delay, and ECL technology. It is used for TTL/CMOS to PECL translation in industrial applications due to its small outline package and wide operating temperature range of -40 °C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,228 parts In-Stock

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Vyrian

USA . 425 parts In-Stock

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SupplyDigital Components

Austria . 6,932 parts In-Stock

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Kulean Microsystems

USA . 6,563 parts In-Stock

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Problanco Electronics

Mexico . 5,790 parts In-Stock

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Corphita

USA . 1,188 parts In-Stock

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TANS Electronics

Latvia . 603 parts In-Stock

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Corohmni

South Africa . 396 parts In-Stock

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UHIMA Technologies

Türkiye . 205 parts In-Stock

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Overview

Upgrade your voltage level translation needs with the MC10EPT20MNR4 by Onsemi. This cutting-edge product offers seamless surface mount installation and a wide operating temperature range, making it perfect for industrial applications. With its advanced ECL technology and fast response time, it ensures reliable performance in diverse environments. Trust in Onsemi's reputation for quality and innovation, and experience the benefits of smooth signal transmission and compatibility enhancement. Elevate your projects with the MC10EPT20MNR4 today!

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and convenient mounting on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for various applications.

Package Shape: SQUARE

Square package shape provides a compact design, suitable for applications where space is limited.

Power Supplies (V): 3.3

Operates efficiently at a common power supply voltage, ensuring compatibility with other components.

No. of Terminals: 8

Provides multiple terminals for versatile connectivity options.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

The combination of small outline, heat sink/slug, thin profile, and shrink pitch makes the package efficient in dissipating heat and reducing overall size.

Minimum Supply Voltage: 3 V

Works effectively within a narrow range of supply voltages, ensuring stable performance.

Maximum Operating Temperature: 85 °C

Operates reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Withstands low temperatures, making it suitable for a wide range of operating conditions.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and reliability in connections.

Terminal Position: DUAL

Dual terminal position allows for flexibility in circuit layout and connectivity.

Maximum Seated Height: 1 mm

Low profile design saves space and allows for compact integration in PCBs.

Width: 2 mm

Narrow width enables placement in tight spaces on the PCB.

Output Polarity: COMPLEMENTARY

Complementary output polarity provides balanced signals for efficient data transmission.

Length: 2 mm

Compact length complements the square package shape, providing an overall space-saving design.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial temperatures, ensuring reliable operation in demanding conditions.

Technology: ECL

Uses ECL technology for high-speed, low-power operation, suitable for high-frequency applications.

Terminal Form: NO LEAD

No-lead terminal form enhances reliability in connections and simplifies PCB assembly.

Nominal Supply Voltage: 3.3 V

Operates at a standard nominal supply voltage, ensuring compatibility with other components.

Maximum Delay: 0.45 ns

Low maximum delay ensures fast signal processing, suitable for high-speed applications.

Terminal Pitch: 0.5 mm

Narrow terminal pitch allows for close spacing of terminals, enabling compact PCB layouts.

Interface IC Type: TTL/CMOS TO PECL TRANSLATOR

Supports interface conversion from TTL/CMOS to PECL, enabling compatibility between different signal types.

Technical Specifications

Voltage Level Translators MC10EPT20MNR4 attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Maximum Delay:

.45 ns

Interface IC Type:

JESD-30 Code:

S-XDSO-N8

JESD-609 Code:

e0

Length:

2 mm

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.08,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Level Translators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

MC10EPT20MNR4 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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