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NB100LVEP91MNG

Onsemi

NB100LVEP91MNG by Onsemi

NB100LVEP91MNG by Onsemi is a voltage level translator with PECL to ECL interface. It operates b/w -40 to 85 °C, with supply voltage range of 2.375V to 3.8V. With a max delay of 0.65ns, it is ideal for industrial applications requiring fast signal translation.

Median Price

$33.160

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 276 parts In-Stock

1+ parts

$33.160

100+ parts

$23.685

1k+ parts

$22.702

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$33.160

$23.685

$22.702

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Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$33.160

100+ parts

$23.030

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$22.700

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101

$33.160

$23.030

$22.700

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Distributors (In-Stock)

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Digiode

USA . 657 parts In-Stock

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$21.328

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$21.328

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Vyrian

USA . 5,559 parts In-Stock

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Chip Stock

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Flip Electronics

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J2 Sourcing AB

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Corphita

USA . 359 parts In-Stock

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$20.205

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359

$20.205

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Corohmni

South Africa . 345 parts In-Stock

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$22.450

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iodParts Technologies Inc.

India . 8,017 parts In-Stock

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SupplyDigital Components

Austria . 5,523 parts In-Stock

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Microchip USA

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Problanco Electronics

Mexico . 3,482 parts In-Stock

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Kepictronics

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TANS Electronics

Latvia . 3,220 parts In-Stock

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 952 parts In-Stock

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Kulean Microsystems

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Overview

Experience seamless voltage level translation with the NB100LVEP91MNG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their products. Ideal for a wide range of applications, this voltage level translator offers unmatched value and benefits to customers. Whether you're looking for precise signal conversion or efficient power management, the NB100LVEP91MNG is the perfect solution for your needs. Trust Onsemi for innovative technology that exceeds expectations.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and convenient installation on a circuit board, saving space and reducing assembly time.

Maximum Supply Voltage: 3.8 V

Support for a high supply voltage allows for compatibility with a wide range of systems and applications.

Package Shape: SQUARE

Square package shape provides efficient use of board space and facilitates uniform placement on PCBs.

No. of Terminals: 24

A higher number of terminals enable the translator to interface with multiple components or systems, increasing versatility.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers enhanced thermal performance and reduced form factor.

Minimum Supply Voltage: 2.375 V

Support for a low supply voltage allows for operation in systems with lower power requirements.

Maximum Operating Temperature: 85 °C

High operating temperature range ensures reliability in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low operating temperature range allows for operation in extreme cold environments without performance degradation.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good solderability and corrosion resistance, enhancing product longevity.

Terminal Position: QUAD

Quad terminal position ensures stable and secure connections for reliable performance.

Maximum Seated Height: 1 mm

Low seated height contributes to the overall compactness and efficiency of the product.

Width: 4 mm

Narrow width facilitates space-saving integration into circuit designs.

Output Polarity: COMPLEMENTARY

Complementary output polarity enables seamless translation and communication between PECL and ECL devices.

Maximum Time At Peak Reflow Temperature (s): 30

Extended reflow time at peak temperature allows for thorough soldering and secure terminal connections.

Peak Reflow Temperature °C: 260

High peak reflow temperature supports reliable and durable solder joints during the assembly process.

Length: 4 mm

Compact length contributes to the overall space efficiency and layout flexibility of the product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in a wide range of industrial applications.

Technology: ECL

ECL technology offers high-speed and low-power consumption benefits for efficient signal translation and communication.

Terminal Form: NO LEAD

No-lead terminal form enhances solder joint reliability and enables RoHS compliance.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance and compatibility with standard voltage levels.

Nominal Negative Supply Voltage: -2.5 V

Support for a negative supply voltage allows for proper signal translation in differential signaling applications.

Maximum Delay: 0.65 ns

Low maximum delay ensures minimal signal distortion and high-speed operation for efficient data transmission.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables precise and secure connections while optimizing board space usage.

Interface IC Type: PECL TO ECL TRANSLATOR

Specific interface IC type indicates compatibility with PECL to ECL translation requirements, ensuring seamless signal conversion.

Technical Specifications

Voltage Level Translators NB100LVEP91MNG attributes and parameters. Explore more Voltage Level Translators devices from Onsemi

Specs

Additional Features:

LVTTL, LVCMOS, HSTL, CML OR LVDS TO LVNECL TRANSLATION ALSO POSSIBLE

Maximum Delay:

.65 ns

Interface IC Type:

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

1

Nominal Negative Supply Voltage:

-2.5 V

No. of Bits:

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Latch/Register:

NONE

Output Polarity:

COMPLEMENTARY

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.8 V

Minimum Supply Voltage:

2.375 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

ECL

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

4 mm

Trade Compliance

NB100LVEP91MNG Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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